Packaging Process Development Engineer
Overview:
In this role you will advance next-generation semiconductor packaging technologies by developing and optimizing assembly processes and equipment. You will work within Intel's Packaging Module Development team to improve quality, reliability, yield, and manufacturability of prototypes. You will collaborate cross-functionally to align with supplier quality and product milestones, driving continuous improvement and measurable impact on product performance. This is a hands-on position at the cutting edge of packaging technology with a strong focus on reliability and manufacturability. Compensation / Benefitscompetitive paystock bonuseshealth benefitsretirement plansvacation
Responsibilities:
- Develop and optimize assembly media and collaterals to meet quality, reliability, cost, yield, productivity, and manufacturability targets
- Apply DOE and SPC to refine media and collateral capabilities and document findings in technical reports
- Design and maintain equipment to evaluate media and collateral performance under simulated field conditions
- Ensure manufacturability of physical prototypes and oversee full lifecycle of manufacturing workflows
- Define material specifications and collaborate with supplier quality and procurement to maintain compliance
- Leverage failure mechanism knowledge to establish reliability benchmarks aligned with customer requirements
- Lead problem-solving initiatives and drive continuous improvement for media and collaterals
- Standardize manufacturing qualification practices and manage technical risks in line with milestones and supplier delivery
- Serve as a subject matter expert, providing technical consultation on media and collateral solutions
Key requirements:
Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM field with 2+ years experience OR Master's degree in mechanical engineering, Materials Science, Metallurgical Engineering, or related STEM field Knowledge of mechanical design software such as SolidWorks or AutoCADMechanical drawings, Geometric Dimensioning and Tolerancing (GD&T) principles
Preferred: 2+ years experience in SPC and DOE methodologies
Experience with high-precision manufacturing methods, stamping and CNC machining Knowledge of semiconductor fabrication processes and packaging technologies Experience with supply chain management in a manufacturing or materials qualification environment Collaborative mindset Analytical thinking Effective communication Statistical Process Control (SPC) Design of Experiments (DOE) High-precision manufacturing methods (stamping, CNC machining)