Semiconductor Packaging Mechanical Design Engineer

Intel Corporation is seeking a proactive and detail-oriented Mechanical Design Engineer in Chandler, Arizona. This role will involve designing and developing mechanical components for semiconductor packaging, collaborating across teams, and addressing design challenges. The ideal candidate will have a Bachelor's degree in mechanical engineering, experience with CAD tools, and strong communication skills. The position offers competitive pay, stock bonuses, and a comprehensive benefits package. #J-18808-Ljbffr