Lead Memory Packaging Engineer - High-Speed DRAM & HVM

Micron Technology in Boise, Idaho seeks a Senior Package Design Engineer to lead co-design activities for advanced DRAM and memory products. You will collaborate globally with cross-functional teams to define and drive product concepts. Ideal candidates will have a Master's degree in Electrical Engineering or a related field combined with extensive hands-on experience in semiconductor package design. Micron offers robust benefits and a supportive work environment. #J-18808-Ljbffr