Packaging Module Engineer Innovate & Optimize Assembly
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Intel Corporation is looking for a highly skilled engineer to develop and optimize assembly processes for future technologies. Located in Chandler, Arizona, the role involves ensuring the manufacturability of package designs while collaborating closely with supplier quality teams.
The ideal candidate will possess a Master’s or PhD in Mechanical Engineering or a related field, with at least 3 years of relevant experience. The position offers a robust compensation package including competitive pay and stock bonuses.
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