Senior Semiconductor Process Engineer

Role Overview You will be a Focal Plane Array Process Engineer with our Infrared Sensors Business on site in Goleta, CA. Our team is responsible for developing and manufacturing advanced FPAs and we are looking for a talented engineer to join our team. What You Will Be Doing As a Senior FPA Process Engineer, you will be the subject‑matter expert for fabrication and execution of advanced Focal Plane Arrays, including wicking, substrate thinning, dicing, and flip‑chip bonding for hybridization. You will play a critical role in developing and optimizing processes, procedures, tooling, and equipment to maximize yield, efficiency, and throughput, and in precisely aligning and bonding detector arrays and read‑out integrated circuits (ROICs) to create high‑performance FPAs. Your responsibilities include, but are not limited to: Work with development and process integration engineers to adapt new processes and techniques into the manufacturing line, including defining requirements for new capabilities and leading FPA processing equipment capital procurement projects. Lead projects related to process definition, fabrication, modification, and evaluation of FPA devices and components. Analyze test data, identify trends and anomalies, and provide feedback to drive process control and improvement initiatives. Contribute to troubleshooting and failure analysis of FPAs, identifying root causes and implementing corrective actions. Develop and maintain documentation, including workflows, work instructions, and process control checklists, ensuring adherence to quality standards and industry protocols. Basic Qualifications Bachelor’s degree in Material Science, Engineering, Physics, or related discipline. 3+ years of experience in semiconductor packaging or FPA manufacturing in a cleanroom environment, with demonstrated expertise in flip‑chip hybridization techniques or related processes such as epoxy die attach/bonding, polishing, substrate removal, or AR coating. Must be a U.S. citizen, as the position requires special facility access. Desired Skills Master’s degree or Ph.D. in Engineering, Physics, or related discipline. Background in IR FPA packaging, specifically flip‑chip hybridization. Knowledge of semiconductor device physics, photodetectors, and FPAs. Proficiency in MS Office (Word, PowerPoint, Excel). Excellent engineering documentation and communication skills. Ability to collaborate effectively with cross‑functional teams and train technical staff. Experience with Design of Experiments (DOE), statistical process control (SPC), and data analysis software such as JMP or MATLAB. Experience with Lean/Six Sigma methodologies. Compensation Annual base salary range in California: $93,200 – $164,450. Additional compensation may reflect location and experience. Benefits Medical, Dental, Vision, Life Insurance, Short‑Term Disability, Long‑Term Disability, 401(k) match, Flexible Spending Accounts, EAP, Education Assistance, Parental Leave, Paid Time Off, and Holidays. Employment Details Full‑time, first shift, 4×10‑hour day schedule with 3 days off per week. Lockheed Martin is an equal opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics. #J-18808-Ljbffr