Integration Engineer
ORCA Computing is developing an ultra-low loss integrated photonics platform for photonic quantum computers. Packaged devices will be deployed in real-world systems and will underpin our longer-term large-scale quantum computing architectures.
ORCA Computing is seeking a Photonic Integration Engineer to combine hands-on photonic component design with ownership of our packaging strategy. This role contributes to the design and optimization of ultra-low-loss components and PIC layouts, while owning packaging specifications, vendor relationships, and the fiber attach, wire bonding, and driver integration processes that get packaged devices to spec.
Key Responsibilities:
Own packaging strategy and specifications, including fiber attach, wire bonding, and RF/driver integration
Manage relationships and specifications with external vendors from development to volume production
Maintain state of the art fiber-PIC coupling performance from the lab to packaged deployed devices
Contribute to the design and optimization of ultra-low-loss passive photonic components and electro-optic (EO) modulators
Develop and refine scalable, repeatable packaging processes
Analyze characterization data and iterate both device- and package-level performance
Maintain thorough documentation
Required Qualifications:
Significant industry experience in photonic or optoelectronic device packaging, including fiber attach
Working knowledge of thermal management and RF/driver integration considerations for packaged photonic devices
Working familiarity with photonic component design and simulation tools such as Lumerical MODE and FDTD
Familiarity with PIC fabrication processes and constraints
Must be based in Austin, TX, with hybrid work flexibility
Preferred Qualifications:
Master’s or PhD in Photonics, Physics, Electrical Engineering, or a related field
Hands-on experience with Si photonics
Familiarity with high-speed RF packaging and signal integrity considerations
Background in quantum photonics or quantum optics