Packaging Engineering

Job Title: Technologist, Packaging Engineering Location: Milpitas, CA (Onsite) Job Type: Full-time, Exempt Position Overview:The Technologist, Packaging Engineering, will be a critical member of our team, responsible for leading the development, qualification, and production readiness of advanced packaging technologies. This role involves managing the entire lifecycle of packaging solutions, ensuring they meet all performance, reliability, and quality requirements. The ideal candidate will have a strong technical background in packaging engineering, experience with high-volume manufacturing, and the ability to collaborate with global teams.Key Responsibilities: Cross-Functional Leadership: Represent Packaging Engineering in cross-functional teams, driving the characterization, qualification, and timely production of packages while meeting all technical specifications. Lifecycle Management: Oversee the entire package lifecycle, from initial development through to high-volume production, collaborating with factories and contract manufacturers globally. New Technology Development: Work closely with global R&D teams to develop and qualify new packaging technologies, ensuring they align with business needs and industry trends. Yield & Cost Optimization: Lead initiatives to improve assembly yields and reduce packaging costs, implementing robust control plans and quality measures to support high-volume production. Process Transition: Facilitate the transition of new products from low-volume to high-volume production, ensuring all necessary documentation, such as FMEA, SOD, Control Plans, and SPC, is in place. Design Validation: Collaborate with internal teams to validate design options, perform comprehensive DFX analysis (including DFM, DFA, and DFRW), and ensure the robustness of packaging solutions. Roadmap Development: Assist in developing and maintaining the Packaging Technology Roadmap, leveraging industry benchmarks and trends to identify gaps and necessary actions. Qualifications: Educational Background: Master’s degree or PhD in Material Science, Manufacturing, Mechanical Engineering, Computer Science, Physics, or a related engineering discipline. Experience: Master’s degree with a minimum of 10 years of relevant work experience, or PhD with at least 8 years of relevant work experience. Technical Expertise: Proficient in packaging domains such as SMT, PCBA, solder joint reliability, board-level reliability, packaging materials, failure analysis, and PCB layout. Additional knowledge in die attach, wire bonding, wafer thinning, and molding is advantageous. Analytical Skills: Exceptional problem-solving abilities, with expertise in experimental design, statistical analysis, and the use of data analytics and AI for decision-making. Industry Knowledge: Strong understanding of thermo-mechanical aspects of semiconductor packages and Solid-State Drives (SSDs). Communication Skills: Excellent written and verbal communication skills, with the ability to collaborate effectively with global teams and stakeholders. Leadership: Experience in mentoring or managing junior engineers is a plus. Email: girish.t@infowaygroup.com Job Type: Full-time Pay: $195,106.00 - $202,516.00 per year Education: Master's (Required) Experience: Technologist/ Packaging Engineering: 10 years (Required) Ability to Commute: Milpitas, CA 95035 (Required) Ability to Relocate: Milpitas, CA 95035: Relocate before starting work (Required) Work Location: In person