Director of Circuit Design
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Architectural and Engineering ManagersElectronics Engineers, Except ComputerComputer Hardware EngineersNatural Sciences ManagersElectrical EngineersIndustries:
Electronic and Precision Equipment Repair and MaintenanceAudio and Video Equipment ManufacturingComputer and Peripheral Equipment ManufacturingSemiconductor and Other Electronic Component ManufacturingPersonal and Household Goods Repair and MaintenanceHigh-Speed IC Design Director – Bay AreaA leading semiconductor innovator is seeking a High-Speed IC Design Director to lead the architecture and development of next-generation high-speed mixed-signal and analog ICs for cutting-edge connectivity and compute applications.This is a rare opportunity to join a well-funded and technically elite engineering organisation developing breakthrough silicon for AI infrastructure, optical interconnect, high-performance networking, and data centre applications.Based in the Bay Area, this role offers significant technical ownership, team leadership responsibility, and direct influence on product and technology strategy.The OpportunityAs High-Speed IC Design Director, you will lead a multidisciplinary IC design team responsible for the delivery of advanced high-speed analog and mixed-signal ASICs in deep submicron CMOS/BiCMOS technologies.You will work closely with executive leadership, system architects, DSP, packaging, and photonics teams to define and execute next-generation silicon roadmaps targeting 100G/200G/400G+ interfaces and beyond.Key focus areas include:High-speed SerDes architectureClocking and timing circuitsTIAs, drivers, CDRs and PLLsAdvanced equalisation techniquesLow-power mixed-signal integrationSilicon-photonics interface ICsHigh-bandwidth connectivity for AI and hyperscale infrastructureResponsibilities:Lead and grow a high-performance IC design organisationDefine architecture and technical direction for high-speed transceiver productsDrive full-chip execution from concept through silicon validationMentor senior analog/mixed-signal engineers and technical leadsCollaborate cross-functionally with systems, DSP, packaging and product teamsOwn design reviews, tapeout readiness, risk management and technical sign-offEngage with customers and executive stakeholders on roadmap and product strategyRecruit and retain world-class engineering talentRequirements:Proven leadership experience managing high-speed IC design teamsStrong background in analog/mixed-signal IC design for high-speed communication systemsDeep expertise in one or more of the following:SerDesPLL/CDRHigh-speed ADC/DACTIAs/driversEqualisation architecturesOptical interconnect ICsExperience delivering silicon in advanced CMOS or BiCMOS nodesTrack record of successful product tapeouts and production rampStrong understanding of signal integrity, jitter, noise and power optimisationExcellent communication and stakeholder management skillsPhD or MSc in Electrical Engineering or related discipline preferredIf you are interested in hearing more, please send me your resume and we can discuss the details.