Program Management Engineer | HVDC
Overview:
As a Program Management Engineer, you lead new HVDC products from concept to release, partnering with leaders across TI to drive actionable plans and innovative solutions. You shape development roadmaps, manage risks, and ensure schedule and budget targets to deliver ROI. You coordinate with wafer fabrication, assembly, test sites, and PPIT partners to align with HVDC roadmap products. You communicate progress to stakeholders and manage customer interactions, including samples and capacity planning. You'll influence GaN/Datacenter ASSP initiatives in a fast, inclusive environment. Compensation / Benefitscompetitive pay and benefitswell-being is importantcountry-specific benefits
Responsibilities:
- Lead cross-functional product development teams through full lifecycle and ensure flawless execution
- Create and monitor comprehensive project plans with risk management, resources, scope, budget, and schedule
- Collaborate with wafer fabrication, assembly and test sites and PPIT partners to meet schedule, cost, and quality goals
- Provide weekly/monthly status updates and articulate support needs to stakeholders
- Serve as liaison between internal teams and external customers to coordinate milestones, deliverables, and samples
- Partner with design and systems engineering to implement productivity enhancements in Core operations
- Develop and execute qualification plans with Product Engineering and Quality Reliability Engineering
- Oversee testing to ensure ICs meet specs and reliability, drive root-cause analysis for failures
- Maintain Galileo system per new product development guidelines from Assess Opportunity Phase to Release to Market and Production
- Coordinate material logistics and TI system setup (MMRs, SAP, SCS, PCS, ATSS, SWRs, etc.)Drive on-time delivery by defining plans for highly competitive products
Key requirements:
Bachelor in Electrical Engineering 5+ years of project engineering/management experience on highly complex products/projectsstrong leadership and influence without authorityclear communication and collaboration across global teamsexcellent problem-solving and analytical abilitiesproject management and lifecycle leadershippackaging and wafer fabrication knowledgereliability testing and tri-temp characterization