Silicon Packaging Engineer - Wireless Communications Solutions

Job DetailsJob Description:About This OpportunityJoin Intel's Wireless Communications Solutions (WCS) team during an exciting period of innovation and new development opportunities. WCS focuses on developing advanced wireless technologies and solutions that enable seamless connectivity across a wide range of devices and platforms. The group specializes in wireless communication products including Wi-Fi, Bluetooth, and emerging wireless standards, delivering high-performance, reliable, and secure wireless solutions.WCS drives innovation in wireless connectivity by integrating cutting-edge hardware and software technologies to meet the evolving needs of consumers and enterprise customers. The business unit ensures regulatory compliance and quality through rigorous product regulatory life cycle management aligned with Intel's global standards and country-specific requirements.WCS is committed to advancing wireless communication capabilities, supporting Intel’s leadership in the wireless ecosystem, and enabling next-generation connected experiences.As a Silicon Packaging Architect/Engineer, you'll drive cutting-edge semiconductor packaging technology and architecture for WiFi, Bluetooth, and mmWave products, focusing on RF/Electrical, Thermal, Mechanical, Reliability, and Cost optimization.What You'll DoStrategic Leadership & Architecture:Translate product requirements into comprehensive package architecture specifications.Lead technology trade-off decisions ensuring packages meet electrical, mechanical, thermal, and reliability standards.Lead Package level simulations (Mechanical and Thermal) to address specific risk areas.Define overall product package performance specifications and drive technology certification.Oversee end-to-end package development processes, from design through production.Technical Excellence & InnovationTroubleshoot complex packaging problems and develop innovative, cost-effective solutionsResearch packaging assembly materials and properties, establishing specifications for suppliersPerform mechanical and reliability simulations to optimize package designConduct thermal performance simulations using predictive FEA analysisCross-Functional CollaborationPartner with silicon, hardware, and package design teams to ensure high-quality deliverablesCoordinate with internal/external manufacturing partners (OSATs) and substrate suppliersSupport product co-design and layout teams as manufacturing liaisonCollaborate with Quality & Reliability teams to ensure products meet specificationsComplete DFMEA assessments with assembly suppliers to evaluate technology risksManufacturing & Process ManagementEnsure seamless transition from design to high-volume productionDesign and validate Test Vehicles for process characterizationProvide consultation on packaging improvements and process optimizationQualificationsWhat We're Looking ForEducation & ExperienceMinimum Requirements:Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science/Engineering, Physics, or related field + 4+ years industry experience.OR Master's degree in relevant field + 3+ years experience.OR PhD in relevant field + 1+ years experience.Required Technical Skills2+ years package assembly technology development experience.2+ years packaging FEA simulations (mechanical and thermal).2+ years package assembly manufacturing processes and HVM ramp experience.Preferred QualificationsExperience working directly with external suppliers (OSATs, Tools, Materials, etc).Semiconductor device physics and process engineering experience.RF Component Packaging experience (highly valued for wireless products).Testing systems experience with hardware/software (Matlab, LabView).Essential SkillsStrong project management capabilities.Proficiency in Microsoft Office Suite.Excellent communication and presentation abilities.Self-driven with strong problem-solving tenacity.Action-oriented mindsetWhy This Role MattersYou'll be at the forefront of wireless technology innovation, directly impacting next-generation WiFi, Bluetooth, and mmWave solutions that connect the world.Job TypeExperienced HireShiftShift 1 (United States of America)Primary Location:US, Oregon, HillsboroAdditional Locations:Business GroupSilicon and Platform Engineering Group (SPE): Deliver breakthrough silicon and platform solutions that deliver industry-leading products today while also defining the next generation of computing experiences.Posting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.Annual Salary Range for jobs which could be performed in the US: $141,910.00 - 200,340.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.