Staff Program Manager - Advanced Packaging Technology

Staff Program Manager – Advanced Packaging Technology Overview The Staff Program Manager will manage one or more very large scale Advanced Packaging manufacturing projects through the entire lifecycle from greenfield factory construction, to tool procurement, and to production ramp, ensuring on‐time technology qualification, successful tech transfer, and production yield optimization. Key Responsibilities Technology Development and Transfer for Production: Achieve on‐time Technology Qualification by collaborating with in‐house and partner R&D teams developing disruptive technologies. Facilitate successful Technology Transfer from R&D into High Volume Manufacturing (HVM) Factory Construction. Tool Procurement & Integration: Work with Factory and R&D Teams on Tool selection, procurement, logistics, and installation of next‐generation equipment for Heterogeneous Integration from global tier‐one vendors. Coordinate complex international logistics to import highly sensitive tooling and materials. Oversee hook‐up, facility integration, and initial hardware qualification of all manufacturing lines. Production Ramp & Yield Optimization: Partner with Factory, R&D teams and Tool vendors for operational transition from tool qualification to HVM readiness. Accelerate yield learning curves and meet target defect‐density metrics in collaboration with process engineering and quality teams. Manage manufacturing cycle time, line balancing, and factory automation deployment during the ramp phase. Establish standard operating procedures (SOPs) and training pipelines to upscale the local workforce for stable production. Financial & Local Regulatory Compliance: Manage multi‐billion‐dollar CapEx and OpEx budgets and cash flows, in collaboration with Finance teams. Ensure compliance with local Regulatory Agency requirements. Implement strict risk‐mitigation frameworks to handle supply chain bottlenecks and labor market constraints. Required Qualifications Education & Experience: Master's degree in Engineering, Materials Science, or related STEM field. MBA preferred. 6+ years managing very large projects, with explicit experience in greenfield factory construction and factory ramps. Domain: Deep technical understanding of advanced packaging and semiconductor manufacturing technologies (Heterogeneous Integration, Substrates, Co‐packaged Optics). Ramp Expertise: Proven track record transitioning a semiconductor facility from construction to high‐volume production. Geography: Foundational knowledge of delivering large‐scale offshore industrial projects. Skills & Certifications: Project management credentials such as PMP, PgMP, or equivalent senior‐level certifications. Strong grasp of factory physics, statistical process control (SPC), yield management, and Lean manufacturing. Expertise in managing global semiconductor tool and material vendors. Advanced mastery of enterprise scheduling tools (e.g., Primavera P6, MS Project). Exceptional stakeholder management skills for navigating dynamically changing business and product requirements. Compensation and Benefits The annual base salary range for this position is $109,700 - $175,500. The role is also eligible for a discretionary annual bonus and equity awards in accordance with the company's plan documents. EEO Statement Broadcom is a proud equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status, or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. #J-18808-Ljbffr