Mechanical Engineer

Qualifications:Bachelor's degree in Mechanical Engineering5-10 years of experience designing enclosures and packaging solutions for RF/Microwave systems and amplifiers, transceiversProficiency in SolidWorks, SolidWorks Simulations or other FEA thermal analysis toolsExperience designing heat sinks, thermal interfaces, and convective/conductive cooling solutionsKnowledge of RF shielding design for RFI/EMI environments, connector integration, and electrical-mechanical interfaces Ability to work on outdoor and space-qualified applications with associated environmental and reliability requirementsExperience with harsh environment requirements and space/aerospace standardsStrong problem-solving and cross-functional collaboration skillsResponsibilities:Design enclosures and thermal management solutions including heat sinks and cooling architectures for mmWave RF/Microwave productsDevelop packaging and enclosure designs for integrated circuits and front-end modules with RF shielding and connector integrationPerform thermal analysis and FEA to validate designs meet performance and reliability requirementsCollaborate with electrical and RF engineers to optimize mechanical designs for RF performance and thermal managementSupport product development from concept through production for outdoor and space-qualified applications