Advanced Packaging & SIPI Specialist

Teradar is pioneering a new era in perception with the world’s first automotive terahertz vision sensor, delivering ultra-high resolution imaging in any weather condition. Founded in Boston, Teradar’s solid-state, chip-scale technology unlocks safer, smarter vehicles and opens the door to transformative applications in mobility, defense, and beyond.The electrical performance of the package substrate is a primary technical challenge for our next-generation sensors. We are seeking an IC Packaging Engineer with SIPI expertise to eliminate this bottleneck. This is a high-impact role for an expert who "lives" in signal and power integrity and will own the development and delivery of advanced packaging solutions from an electrical-first perspective.ResponsibilitiesSIPI Ownership: Lead the end-to-end Signal and Power Integrity (SIPI) strategy, performing extensive simulations to solve complex high-speed signaling and power delivery challenges.Substrate Design: Personally execute substrate layouts, stack-up definitions, and routing constraints for multi-chip RFIC/SoC integration.Advanced Modeling: Build and validate 3D EM models for 2.5D packages, UCIe interconnects, and interposer-based solutions.Co-Optimization: Partner with RFIC and Digital teams to optimize the "simulation-to-layout" pipeline, ensuring designs are production-ready for the automotive market.Analysis-Driven Design: Perform DC/AC/Transient analysis to meet strict target impedance and IR drop requirements.Automotive Execution: Drive DFM and reliability qualification to meet automotive-grade requirements (AEC-Q) without compromising electrical performance.Vendor Management: Lead technical engagements with OSATs and substrate suppliers to ensure layout execution matches simulation models.Validation: Correlate simulation results with lab measurements (VNA, TDR) to ensure first-pass success.Key QualificationsEducation: M.S. or Ph.D. in Electrical Engineering (EE)Technical Depth: 10+ years of experience with a primary focus on Signal and Power Integrity. Must demonstrate "True Execution" (running the analysis yourself, not just managing it).Tooling Mastery: Expert proficiency in Ansys (HFSS, SIwave, Q3D), Cadence (Sigrity, Allegro), or Keysight ADS.Architecture Experience: Deep knowledge of UCIe interconnects, 2.5D/3D interposers, and high-speed digital packaging.Manufacturing: Experience driving complex SIPI designs into high-volume manufacturing (HVM), ideally within the automotive or high-performance computing sectors.Communication: Ability to explain complex electrical trade-offs to cross-functional teams and thrive in a fast-paced start-up environment.Why JoinTechnical Authority: Define the electrical roadmap for breakthrough ADAS technology where packaging is the critical path.World-Class Team: Collaborate with elite engineers across RFIC, SoC, and system design.High-Growth: Be a key pillar of a well-funded ($150M+) start-up bringing disruptive tech to market.Comp & Flexibility: Competitive compensation, stock options, and flexible work arrangements.📩 Interested?DM me or send your resume to ben.h@vividtechnology.io