Simulation Engineer

*Role Overview* We are seeking a Simulation Engineer to model and optimize advanced electronics packages for high-performance computing and datacenter applications. The role is centered on *package-level thermal and thermomechanical simulation*, with additional opportunities to work on electrical and fluid-dynamics problems. You will develop models that capture the interactions between package architecture, materials, interfaces, warpage, contact mechanics, and thermal performance. These models will be used not only to evaluate designs, but to explore design spaces, identify important parameters and tradeoffs, and guide package and system design decisions. Deep familiarity with advanced electronics packaging is important for this role. We are looking for someone who understands how modern packages are constructed, the physical problems that arise within them, and how to translate those problems into useful simulation models. *Key Responsibilities* * Develop and execute package-level *thermal and thermomechanical simulations* using ANSYS Icepak, ANSYS Mechanical, and related simulation tools * Model advanced package architectures including *lidded and lidless packages, 2.5D/3D integration, chiplets, silicon interposers, organic substrates, underfill, microbumps/hybrid bonding, and HBM* * Analyze *package warpage, thermomechanical stress, contact mechanics, and TIM compression/contact* * Evaluate the interaction between package warpage, TIM behavior, bond-line thickness/contact, and thermal performance * Model the thermomechanical behavior of interposers and package structures incorporating new materials * Perform steady-state and transient thermal analysis, including heat spreading, hotspots, package thermal resistance, interfaces, and temperature-dependent material properties * Build parameterized models and perform *sensitivity analysis, DOE, and design-space exploration* to understand key design variables and optimize package performance * Use simulation to evaluate package geometries, material choices, interfaces, stack-ups, and other design parameters and provide actionable recommendations to design teams * Work with experimental teams to compare simulation predictions against physical hardware and use experimental results to improve model fidelity * Identify the material properties, boundary conditions, and experimental inputs required to construct physically meaningful models * Contribute to electrical and system-level simulation efforts as needed, including SI/PI analysis * Support broader thermal/fluid modeling, including conjugate heat transfer and electronics cooling, where appropriate *Required Qualifications* * B.S. in Mechanical Engineering, Materials Science, Applied Physics, Electrical Engineering, or a related technical field * 2+ years of relevant industry or research experience in thermal, mechanical, or multiphysics simulation; relevant graduate research may substitute for industry experience * Strong fundamentals in *heat transfer, solid mechanics, and thermomechanical analysis* * Hands-on experience with finite-element and/or thermal simulation tools, preferably *ANSYS Mechanical and ANSYS Icepak* * Experience modeling thermally induced deformation, stress, warpage, contact, or related thermomechanical phenomena * Strong working knowledge of *advanced electronics packaging*, including the construction and behavior of modern high-performance semiconductor packages * Familiarity with package elements and technologies such as dies, lids, TIMs, substrates, interposers, underfill, microbumps, HBM, chiplets, and 2.5D/3D integration * Ability to translate physical design problems into appropriate simulation assumptions, boundary conditions, material inputs, and modeling approaches * Strong engineering fundamentals and the ability to learn new simulation domains, tools, and physical phenomena quickly *Preferred Qualifications* * M.S. or Ph.D. in Mechanical Engineering, Materials Science, Applied Physics, Electrical Engineering, or a related field * Experience modeling *TIM compression, package warpage, and the resulting effects on thermal interfaces and thermal performance* * Experience with nonlinear contact mechanics or temperature-dependent material behavior * Experience using simulation for *design optimization, parameter sweeps, sensitivity analysis, or DOE* * Experience correlating simulation results with experimental measurements or physical prototypes * Experience incorporating novel or non-standard materials into thermal or mechanical models, including identifying the material properties required for meaningful simulation * Familiarity with signal integrity and/or power integrity simulation * Experience with CFD, conjugate heat transfer, or electronics cooling at the board, server, or rack level *What We Value* We do not expect candidates to have worked on every problem or simulation domain listed above. We place greater value on *strong engineering fundamentals, physical intuition, advanced-packaging knowledge, and the ability to formulate the right simulation problem* than on familiarity with any particular software workflow. The ideal candidate can understand the package and the underlying physics, identify the important assumptions and inputs, determine what should be modeled, and use simulation to help guide the design. Pay: $140,000.00 - $180,000.00 per year Benefits: * 401(k) * Dental insurance * Flexible schedule * Health insurance * Health savings account * Life insurance * Paid time off * Retirement plan * Vision insurance Ability to Commute: * Newark, CA 94560 (Required) Work Location: In person