Substrate Layout Engineer - Chiplet Packaging
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Eridu is looking for an experienced Substrate Layout Design Engineer to enhance AI infrastructure technology in San Francisco. This role focuses on the physical layout of high-density substrates for multi-die packages and requires collaboration with various engineering teams to ensure optimal design and manufacturability.
The ideal candidate will have 8+ years of experience in advanced substrate layout, proficiency in Siemens Xpedition, and a strong understanding of packaging constraints. A competitive salary and opportunities to impact AI performance await.
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