Lead RF PCB Layout Engineer

Requirements B.S. in Electrical Engineering, or a related field with 8+ years of relevant experience Experience in PCB layout, fabrication, and release of RF and/or high-performance electronics Excellent teamwork and communication skills Learns new concepts rapidly, completely, and in a self-directed manner High levels of self-motivation and personal accountability Ability to work in a fast-paced environment under significant time constraints (Desirable) Experience designing RF and microwave PCB layouts including controlled-impedance routing, launches and transitions, grounding, shielding, and isolation (Desirable) Comfort with Altium Designer for constraint-driven layout and clean manufacturing outputs; experience with Allegro and/or OrCAD is a plus (Desirable) Experience developing PCB stack-ups and layout constraints for high-frequency, high-performance electronics (Desirable) A strong intuition for layout-driven RF behavior, including coupling, return paths, leakage, spurious paths, and stability risks (Desirable) Experience working closely with RF design engineers to translate schematic intent into layouts that work on the first spin (Desirable) Experience with manufacturing release, DFM/DFT considerations, and collaborating with fabrication and assembly partners (Desirable) Experience supporting lab bring-up and RF characterization alongside design and test engineers (e.g., helping troubleshoot issues seen on VNAs, spectrum analyzers, and in system testing) (Desirable) Experience with EM and RF analysis workflows for layout validation (e.g., HFSS, CST, ADS Momentum) is a plus (Desirable) Experience taking RF hardware from prototype through qualification and environmental testing What the job involves As a Lead RF PCB Layout Engineer, you will own the physical implementation of Array’s RF and microwave electronics in Altium, translating schematics and performance requirements into layouts that work on the first spin Your work will include component placement, controlled-impedance routing, stack-up definition, grounding and shielding strategy, connector and launch design, and isolation of sensitive RF and mixed‑signal domains You will partner closely with RF design, electrical, antenna, mixed‑signal, mechanical, and test engineers to drive layout constraints, reviews, and manufacturing releases The boards you ship will directly determine RF performance, stability, spurious behavior, and overall sensor reliability in the lab and on orbit Own RF PCB layout from initial placement through manufacturing release in Altium Designer Define and implement stack-ups, controlled‑impedance routing, and RF grounding, shielding, and isolation strategies Translate schematic intent into layouts that meet RF performance requirements, including connector launches, transitions, filtering, and protection circuitry placement Partner with RF design, electrical, antenna, mixed‑signal, mechanical, and test engineers to develop layout constraints, run reviews, and de‑risk first‑pass success Drive DFM/DFT considerations with fabrication and assembly partners, including documentation and release artifacts #J-18808-Ljbffr