Process Integration Engineer

About the CompanyAn advanced semiconductor manufacturing organization is expanding its technology development team and is seeking an experienced BEOL Process Integration Engineer to support next‑generation process platforms. This role sits at the intersection of research, development, and high‑volume manufacturing, with direct ownership of back‑end‑of‑line integration for advanced lithography nodes.About the RoleYou will play a critical role in translating novel process concepts into manufacturable, production‑ready technologies. Working cross‑functionally with lithography, unit process, reliability, and packaging stakeholders, you will help shape scalable BEOL solutions that meet demanding performance, yield, and reliability objectives. This opportunity is well‑suited for engineers who thrive in technically complex environments and want to influence the future of advanced semiconductor technologies.ResponsibilitiesLead end‑to‑end BEOL integration strategies to achieve electrical, physical, yield, and reliability targets at advanced technology nodesDefine and optimize process flows through structured experimentation in partnership with unit process development teamsCollaborate with lithography and modeling specialists to validate patterning solutions and drive continuous improvementsEnsure BEOL integration aligns with downstream test, assembly, and packaging robustness requirementsDrive execution against aggressive development schedules while balancing technical risk, manufacturability, and costCommunicate technical progress, trade‑offs, and decisions clearly to cross‑disciplinary stakeholders QualificationsMaster’s degree in Electrical Engineering, Materials Science, or a closely related technical disciplineMinimum of 5 years of hands‑on experience developing BEOL processes at advanced technology nodes (28nm and below) Required SkillsStrong background in process integration, experiment design, and data‑driven decision makingExperience with advanced BEOL elements such as resistive memory, thin‑film resistors, or metal‑insulator‑metal capacitors is advantageousDemonstrated ability to manage multiple parallel workstreams and deliver results under tight timelinesProven track record of cross‑functional collaboration in complex engineering environmentsClear, confident written and verbal communication skillsSelf‑driven mindset with strong analytical, problem‑solving, and organizational capabilities Preferred SkillsDoctoral degree in a relevant field is a plus but not required Pay range and compensation packageCompetitive compensation and comprehensive benefitsEqual Opportunity StatementExposure to advanced semiconductor technology development. Opportunities for technical growth and long‑term career progression. A collaborative, inclusive engineering culture focused on innovation and impact.