EMIB-T Substrate Program Integrator

Overview In this role you will lead EMIB-T substrate technology development and qualification, ensuring suppliers reach readiness for growing demand. You will steer technical enablement, manage milestones, and collaborate with cross-functional teams, suppliers, and platform partners. You’ll influence advanced packaging initiatives and drive alignment across global teams. The position offers a meaningful chance to shape cutting-edge packaging solutions in a high-impact environment. Compensation / Benefitscompetitive paystock bonuseshealth benefitsretirement plansvacationbonus programs Responsibilitieslead EMIB-T substrate technology development and qualification activitiesdrive readiness milestones and ensure supplier readiness for demandenable cross-functional engineering collaboration with suppliers and platform partnersmanage complex projects in TD/high-volume manufacturing settingssupport technology enablement and alignment across global teams Key requirementsBachelor's degree in Engineering with 6+ years of experience, or Master's with 4+ years, or PhD with 2+ yearsexperience managing complex TD/high-volume manufacturing projectsstrong foundation in advanced packaging, substrates, or semiconductor manufacturingleadership in supplier management or technology enablementability to drive alignment across global teamsfamiliarity with characterization techniques (X-ray, SEM, FTIR, EDX)experience with process flow development, FMEA, DOE, and problem-solving toolsfamiliarity with SPC for yield improvementleadershipability to thrive in high-ambiguity environmentscross-functional collaborationadvanced packaging technologiessubstrate/assembly manufacturing methodologiescharacterization techniques: X-ray, SEM, FTIR, EDX