Remote IC Package Design Engineer (Flip-Chip/SerDes)
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A global engineering and sciences firm is seeking a remote Integrated Circuit Design Engineer to design complex flip-chip-BGA packages for advanced ASICs. The ideal candidate will have over 5 years of experience in package design, particularly with high-speed SerDes, and will use tools like Cadence APD. This position offers an opportunity to work on cutting-edge technology supporting AI and high-performance computing, along with competitive pay ranging from $60 to $100/hr.#J-18808-Ljbffr