IC Packaging Engineer: RF, Thermal & Reliability

A leading aerospace manufacturer in Texas seeks an experienced IC Package Engineer to develop high-reliability IC packaging solutions. The role involves designing and qualifying advanced packaging technologies and evaluating materials for thermal and electrical performance. Candidates should have a bachelor’s degree in engineering and 1+ years of applicable experience. Strong skills in semiconductor packaging and project management are essential. This position offers a competitive salary and the chance to work on cutting-edge technology. #J-18808-Ljbffr