CMP Process Development Engineer

Summary: Under the direction of the Sr. Manager of CMP Process Development, the CMP Process Development Engineer is responsible for developing and delivering strategies for improving and optimizing wafer CMP and post-CMP cleaning processes and procedures; designing and conducting routine wafer experiments, analyzing the data, and reporting the results; developing and implementing practices or methodologies which reduce cost and improve operational efficiency; conducting root cause analysis and implementing corrective action; developing and implementing procedures for transitioning new products into the production line; and reviewing, updating, and maintaining documentation and process instructions. This position is located in Milpitas, California.Key Responsibilities:Develops and delivers strategies for improving and optimizing CMP and post-CMP cleaning processes and procedures.Develops and implements practices or methodologies which reduce cost and improve operational efficiency.Conducts root cause analysis and implements corrective action if required.Develops and implements processes or procedures for transitioning new products into the production line.Resolves process or metrology issues related to material selection; recommends corrective action.Reviews, updates, and maintains documentation and process instructions.Instructs operators and technicians on processes and procedures, including modifications to existing procedures.Partners with equipment and maintenance personnel to minimize tool down time and integrate new tools into the production line.Designs and conducts routine experiments, analyzes data, and develops recommendations for improving cost or operational efficiency.Partners with other groups and departments, including process and product engineering to develop and implement new processes which reduce scrap and improve yield.Responds to inquiries from other team members, managers, or departments.Adheres to all safety policies and procedures as required.Performs other duties of a similar nature or level.Required Qualifications:Master’s degree in Chemical Engineering, Material Science, Chemistry, or a related field with Three+ years of experience, or a Ph.D. with 1+ years of experience.Solid understanding of semiconductor processing, material science, and chemical-mechanical interactions.Experience with design of experiment techniques (DOE), SPC, defect analysis, and data analysis.Experience with CMP equipment (e.g., Applied Materials, Ebara), metrology tools, and data analysis software (e.g., JMP, SQL).Knowledge, Skills & Abilities:Knowledge of CMP manufacturing processes, practices, and techniquesKnowledge of wafer fabrication processing techniques and tools Knowledge of various metrology and optical inspection tools and techniquesKnowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentationsAble to design experiments, analyze results, and recommend corrective action in order to reduce scrap and improve yieldAble to work productively and collaboratively with all levels of employees and management Able to comply with all safety policies and procedures Demonstrated organizational and time management skillsDemonstrated problem-solving and trouble shooting skillsFlexible and able to prioritizeThe annual rate for this full-time position is between $95,000.00-150,000.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual pay range shown is subject to change and may be modified periodically.