Microelectronics Engineering Technician – Wire Bonding & Precision Assembly

CTG is seeking to fill a *Microelectronics Engineering Technician – Wire Bonding & Precision Assembly* position for our client. *Location:* San Jose, CA *Duration:* 3 months *Duties:* * Perform precision wire bonding, automated bonding, and microelectronic assembly operations. * Operate and set up wire bonders, auto bonders, furnaces, loaders, and other specialized manufacturing equipment. * Inspect SMT, PCB assemblies, box builds, electronic components, and microelectronic assemblies using microscopes and magnification tools. * Perform First Article Inspection (FAI), IPC-610 inspections, lot sampling, pass/fail evaluations, and final product acceptance testing. * Conduct process testing and validation, including temperature control, peel testing on IC components, and customer simulation testing. * Verify Bills of Material (BOMs), engineering change notices, manufacturing processes, and production readiness requirements. * Document inspection results, defects, process deviations, and quality findings in accordance with established procedures. * Support failure analysis, root cause investigations, process audits, and continuous quality improvement activities. * Ensure manufacturing and inspection activities comply with engineering specifications, quality standards, and process requirements. *Skills:* * Wire Bonder and Auto Bonder operation * Precision mechanical tools and instruments * SMT and PCB assembly inspection * AOI (Automated Optical Inspection) * First Article Inspection (FAI) * IPC-610 standards * Microscope and magnification inspection * Electronic component and microelectronics inspection * Furnace setup, sintering, and loader machine operations * Process testing and validation * Peel testing on IC components * Quality control and quality assurance * Statistical and lot sampling techniques * MES and manufacturing process documentation * Defect detection, identification, and reporting * Process verification, compliance, and auditing *Experience:* * Minimum 5 years of experience working in a high-tech manufacturing environment, preferably in microelectronics, semiconductor, or medical device manufacturing. * Hands-on experience operating high-precision mechanical tools and wire bonding equipment is preferred. * Experience with precision assembly, inspection, quality verification, and manufacturing processes. * Experience working with microscopes and other magnification tools for detailed component inspection. * Ability to follow detailed manufacturing procedures, engineering specifications, and quality standards. * Experience documenting inspection results and supporting failure analysis or root cause investigations. *Education:* * Technical certification, associate degree, or coursework in electronics, microelectronics, manufacturing technology, or a related field is preferred. Pay: $35.00 - $37.00 per hour Work Location: In person