Module Development Engineer
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This role involves leading development and enablement of dry etch processes for high-volume semiconductor manufacturing and future technologies.It requires expertise in plasma physics, process integration, equipment modifications, and materials characterization to optimize device fabrication and enable advanced architectures.The candidate will conduct feasibility studies, develop process roadmaps, and collaborate with suppliers and cross-functional teams.Strong experience in process innovation, data analytics, and industry-leading contributions is essential.Qualifications include a PhD or Master’s with extensive relevant experience in semiconductor manufacturing, especially dry etch processes.This onsite position offers competitive compensation, benefits, and requires an extended background check.Locations include multiple US sites, with a salary range of $201,330–$284,230.Candidate must demonstrate technical leadership and influence across organizations.