R&D Scientist - High Performance Computing Materials

Job Summary We are seeking an accomplished R&D Scientist to lead Avient's innovation in next-generation thermoplastic materials for High Performance Computing (HPC), AI infrastructure, and hyperscale data center applications. This technical leader will develop advanced low dielectric constant and ultra-low dielectric loss materials for high-speed connector systems operating at increasingly demanding data rates. The successful candidate will combine expertise in materials science, electrical performance, device physics, and advanced characterization to accelerate commercialization of breakthrough materials for next-generation computing architectures. The ideal candidate will have deep knowledge of the relationship among material structure, processing, characterization of electrical performance for complex form-factors, with experience supporting high-speed connectors, semiconductor packaging, advanced interconnects, data communications, RF systems, or other signal integrity-critical technologies. As part of Avient's Corporate Technology Innovation organization, this role will influence technology strategy, intellectual property development, customer engagement, and future growth platforms at the forefront of AI and digital infrastructure. #J-18808-Ljbffr