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Senior Packaging Engineer - High-Speed SSD/NAND

electrical engineers
microsystems engineers
helpers production workers
solidigm
miscellaneous durable goods merchant wholesalersplastics product manufacturing
California, MO
March 20th, 2026
A global technology company is seeking a Package Developer to enhance packaging technologies for SSD and NAND flash storage. The role involves developing packaging designs, supporting integration of product requirements, and managing cross-functional teams. Candidates should possess relevant engineering degrees along with substantial experience in IC packaging. This in-office opportunity in Rancho Cordova, California offers competitive compensation within the range of $170,640 - $273,100 based on experience. J-18808-Ljbffr

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