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Utilizes a real-time distributed control system to meet wafer performance requirements. Designs, tests, and troubleshoots mixed-signal circuit boards that bridge the sensors and actuators with the high-level system software.
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Experience with wafer-scale processing techniques and associated equipment, such as: photolithography, electron beam lithography, thin-film physical vapor deposition (PVD), electroplating, reactive ion etching (RIE), ellipsometry and profilometry tools.
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Experience in the semiconductor industry and wafer processing equipment. Experience in the semiconductor industry and wafer processing equipment. Understanding of semiconductor processes and equipment in fabrication.
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Responsible for packaging/assembly of semiconductor devices (training disciplines include Wire Bonding, Silicon Wafer Prep, Silicon Die Attach, Plastic Encapsulation/Lid Seal, Surface Mount, Plastic Package Decapsulation and more.
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You will be developing automated semiconductor process equipment that delivers wafer-to-atomic information, enabling our customers to make timely decisions. You will be developing automated semiconductor process equipment that delivers wafer-to-atomic information, enabling our customers to make timely decisions.
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As part of this exciting growth opportunity, the Fab 9 Foveros Die Sort and Wafer Sort organizations are seeking a Sort/Test Process Engineer to join our team as a key contributor to our startup and ramp into HVM.
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Previous experience in one or more of the following areas: Advanced packaging processing (e.g., wafer bonding, die bonding, C4, surface mount technology) Wafer-level processing (e.g., lithography, wet etch, dry etch, PVD, PECVD, CMP, metrology.
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Client Details: Semiconductor Manufacturing and designs, manufactures, markets and supports semiconductor wafer processing equipment used in the fabrication of integrated circuits. We are a key supplier of dry strip, rapid thermal anneal, plasma etch, and millisecond anneal equipment to the global semiconductor industry.
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3 to 5 years of semiconductor process engineering experience in CMP related process preferably in 300mm wafer fab. 3 to 5 years of semiconductor process engineering experience in CMP related process preferably in 300mm wafer fab.
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For semiconductor tool manufacturers, Veriflo offers ultra-high purity stainless steel and fluoropolymer fittings, valves, regulators and manifolds for VMBs,CMBs, tooling modules, wafer cleaning, wet etching and other specialized microelectronics processing applications.
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Knowledge and experience of semiconductor test equipment configurations and application; this applies to all test equipment such as electrical testers, package handlers, wafer probers and burn in ovens.
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As a Manufacturing Technician you will perform functions associated with wafer production, including photolithography, thin film, etch, diffusion, inspection, bonding and saw and grind - all in support of the printing industry.
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Performs standard Tier I procedures including wafer measurement. Performs standard Tier I procedures including wafer measurement. Uses knowledge management systems. For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.
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The Automation Equipment Engineer will be responsible for the maintenance & management of the Wafer automation equipment at the new QCELLS factory in Cartersville, GA. This includes improvements for all automation.
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Handle wafers and operate various equipment in performing functions such as: wafer scribe, diffusion, photoresist, alignment, masking etch, various evaporators, metal etch, and disco saw. 1+ years of wafer fab experience preferred.
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wafer job
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