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TE Rack Assembly Drawings, Interconnect Diagrams, Parts Lists, Design Review preparation (TE SRR, TE CDR, TE Validation), Subject areas of demonstrated ability should include all mechanical aspects of Test Station, ITA, Cable and Interconnect Diagram design, Requirements review, and TE Validation.
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Design and Planning: Oversee and prepare plans, specifications, quantities, and cost estimates for traffic engineering components, including intersection geometry, signing and pavement markings, traffic signals, signal interconnect, roadway lighting, ITS, construction sequencing, and work zone traffic control.
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This position will focus on supporting advanced packaging processing and process development, for, but not limited to, silicon interposer fabrication, through silicon via (TSV) fabrication, wafer bumping and micro-bumping, package assembly, and integrating a combination of interconnect technologies together.
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Design for signal integrity, including SerDes, power, and interconnect. Good PCB design experience in high-speed signals routing guideline and review, power copper routing and review, and design for EMI/ESD protection.
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This will include creation of electrical specifications, system interconnect diagrams, wire routing, connector design, LRU electrical requirements and related areas. Today, our brands include EchoStar, Hughes, DISH TV, Sling TV, Boost Infinite, Boost Mobile, DISH Wireless, OnTech and GenMobile.
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Strong working knowledge and understanding of electro-mechanical and interconnect components is required, Spellman High Voltage Electronics Corp. is a leading and growing international company that delivers advanced products and solutions into the medical imaging, Non-Destructive Testing (NDT), Food Inspection and Transport Security markets at the global scale.
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Develops complete layout and engineering drawings of a variety of components and assemblies such as schematics, interconnect lists, parts breakdown, printed circuit board layouts, wire lists, etc., from notes, rough sketches or general instructions of engineers and designers.
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Device physics and interconnect technology characterization experience. Device physics and interconnect technology characterization experience. With the first Open System Foundry model in the world, our combined offerings of wafer fabrication, advanced process, and packaging technology, chiplet, software, robust ecosystem, and assembly and test capabilities help our customers build their innovative silicon designs and deliver full end-to-end customizable products from Intel's secure, resilient, and sustainable source of supply.
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In this position, you will perform interconnect modeling, system level signal integrity and timing simulation, as well as power integrity analysis to make CCS products succeed. Strong fundamentals of signal integrity, transmission lines, EM and microwave theory; Experience in using 2-D and 3-D EM tools such as HFSS, CST, ADS or lab equipments such as TDR, VNA will be preferred.
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Work Experience with the manufacturing inspection and acceptance of Interconnect parts (connectors, cables, harnesses) from multiple different manufacturing processes. Experience with product test, equipment and instrumentation, knowledge of thermal processes, welding and brazing, finishes and coatings, nondestructive testing, fabrication, composites and other common processes common in the Aerospace and Defense Industries.
$112,420 - $191,070 a yearFull-timeRemoteExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Our employees work on the world's most advanced electronics - from saving emissions in the City of Lights to powering the Mars Rover to protecting the F-35 fighter jet. We are looking for a Supplier Quality Engineer to implement tools and processes to ensure suppliers improve on current products with robust plans and deliver first time quality to BAE program customers.
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As a Koch company, Molex is a leading supplier of connectors and interconnect components, driving innovation in electronics and supporting industries from automotive to health care and consumer to data communications.
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Designs include the electrical interconnect to the bulk power grid and all associated power generating facility auxiliary power equipment. Equipment includes rotating machines, such as generators and motors, solar cells and inverters, battery storage and inverters, large power transformers, generator circuit breakers, isolated phase bus duct, non-segregated phase bus ducts, switchgear, motor control centers, small power transformers, variable frequency drives, and battery and UPS systems.
$71,000 - $101,000 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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The BDM will be responsible for aggressively pursuing Printed Circuit Board business to ensure market share growth and position the Interconnect Technology Group for future business successes. PCB Business Development Manager will develop relationships within target customers to penetrate organization and open doors to new business opportunities for the assigned Printed Circuit Board Business unit for Southern California.
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Microchip is also a pioneer in embedding RiscV processors in FPGAs∯*∯ The successful applicant will work as part a core team that develops future FPGA architectures, including programmable fabrics, IO, hard IP blocks, compute, system interconnect, configuration, security, and collaborates with design & software engineering to successfully architect, develop, verify, and integrate the future products.
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