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Technical Package Product Manager & Member of Technical Staff
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- Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
- Your responsibilities include collaborating with customers on their package product requirements and solutions; defining test vehicles to deliver the necessary advanced package design rules, new materials and integrations; and providing consultation on package design, thermal, electrical, mechanical, reliability, and cost considerations.
- Your role will contribute to the synergy between product market development, die and package design, and chip to package interactions, ensuring they are seamlessly integrated with assembly, testing, manufacturing, and global quality standards.
- Defining memory package design rule roadmap for wirebond stacked memory applications.
- Including rules to achieve reliability requirements, Chip-Package-Interaction (CPI), substrate design, die stacking and materials.
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