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Sr Specialist, Advanced Electronics Packaging Development Engineer
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Temporary
- The L3Harris Microelectronics organization is growing our advanced packaging research and development efforts and capabilities.
- This role will allow you to pursue and then lead new business opportunities in Microelectronics related to advanced packaging including 2.5D and 3D Integration, high density build up, photonic integrated circuits, thermal management, and failure analysis.
- The role will place you within a multidisciplinary team of scientists and engineers to deliver vital contributions to mission critical microelectronics solutions that help protect the U.S.A and our allies.
- Work with Chief Engineers and subject matter experts (SMEs) to support opportunity development, shaping, pursuit, capture, winning, and then executions of advanced packaging and microelectronics business.
- Lead new programs and projects in Microelectronics.
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