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Sr. Process Integration Engineer - Advanced Packaging
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- Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
- Micron has an outstanding opportunity for a high energy, tenacious, ambitious, results driven individual with a strong work ethic and integrity to join our Wafer Level Packaging Technologies Team in Boise, Idaho.
- As an Advanced Package TD Process Integration Engineer at Micron, you will define technology requirements, build program plans, and secure resources to drive process technology development programs.
- More specifically, you will develop sophisticated interconnect technology solutions that include wafer to wafer bonding, using Hybrid Bonding, or Fusion bonding.
- You will integrate process flows that involve thinning of wafers and through wafer interconnect schemes.
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