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Semiconductor Packaging Engineer
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- This position is to be filled with an applicant that can collaborate with a cross-functional multi-diverse team supporting photonics and electronic integrated circuit technologies.
- The position is for a back-end process / packaging engineer to join our packaging process engineering team to support manufacturing and development of semiconductor-based optics/optoelectronic components.
- This engineer will sustain the process and equipment of wafer back-end manufacturing processes, such as die singulation, pick & place and sorting, wire bonding, flip chip die bonding, underfills, encapsulation molding.
- micro-dispensing, optical alignment, polishing, hermetic packaging and final printed circuit board laminate assembly.
- Strong technical background in either optoelectronics or semiconductor device packaging with knowledge of Cu pillar and Pb free solder bumps industry experience is highly preferred.
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