L3Harris Technologies

Job Title: Scientist, Mechanical Engineer (Thermal Analyst) - Secret ClearanceJob Code: 11138Job Location: Plano, TX (On-Site)Job Schedule: 9/80: Employees work 9 out of every 14 days – totaling 80 hours worked – and have every other Friday off.. Relocation: Relocation assistance can be provided for qualified candidatesJob Description:This Scientist, Thermal Analyst role will work over a broad range of thermal issues for thermal management of high-power electronics from chip-level simulation to airframe aero-heating analysis.. The Agile Development Group (ADG) specializes in developing disruptive, next-generation technologies for advanced Unmanned Air Systems (UAS / UAV), advanced radar systems, next-generation weapon systems, and other RF sensor technologies using small company agility and big company experience.. Essential Functions:Thermal modeling of electronic systems and thermal management solutions using FEA, CFD, and analyzes based on first principles.. Proficient with ANSYS or Ice Pak thermal analysis software.

mechanical engineer

L3Harris is dedicated to recruiting and developing diverse, high-performing talent who are passionate about what they do. Our employees are unified in a shared dedication to our customers’ mission and quest for professional growth. L3Harris provides an inclusive, engaging environment designed to empower employees and promote work-life success. Fundamental to our culture is an unwavering focus on values, dedication to our communities, and commitment to excellence in everything we do. L3Harris Technologies is an agile global aerospace and defense technology innovator, delivering end-to-end solutions that meet customers’ mission-critical needs. The company provides advanced defense and commercial technologies across space, air, land, sea and cyber domains. L3Harris has approximately $18 billion in annual revenue and 50,000 employees, with customers in more than 100 countries. Job Title: Scientist, Mechanical Engineer (Thermal Analyst) - Secret ClearanceJob Code: 11138Job Location: Plano, TX (On-Site)Job Schedule: 9/80: Employees work 9 out of every 14 days – totaling 80 hours worked – and have every other Friday off.Relocation: Relocation assistance can be provided for qualified candidatesJob Description:This Scientist, Thermal Analyst role will work over a broad range of thermal issues for thermal management of high-power electronics from chip-level simulation to airframe aero-heating analysis. This role is responsible for support of all programs at the L3Harris Plano facility and occasionally assist other facilities.The Agile Development Group (ADG) specializes in developing disruptive, next-generation technologies for advanced Unmanned Air Systems (UAS / UAV), advanced radar systems, next-generation weapon systems, and other RF sensor technologies using small company agility and big company experience.Essential Functions:Thermal modeling of electronic systems and thermal management solutions using FEA, CFD, and analyzes based on first principles.In cooperation with design engineers, specify thermal management solutions for high power, high heat flux electronic assemblies.Design / specify heat exchangers.Design / specify liquid cooled cold walls and thermal planes.Design/ specify phase change active cooling solutions.Design thermal test set-ups and execute or oversee testing programs.Derive thermal conditions for vehicles during a range of flight conditions including the effects of MACH number, angle of attack and altitude.Primary point-of-contact with various technical customers, suppliers, and sub-contractors on technical matters of custom thermal management solutions.Support of proposals contributing conceptual thermal designs, costs & performance estimates.Concisely present results of major analysis in peer reviewsDemonstrate specification compliance to thermal requirements before customers at formal reviews.Documentation of analysis for historical access.Review analysis of other engineers & mentor in proper analytic techniques.Ability to obtain and maintain any additional clearances as required.Ability to lift to 10 lbs.Up to 10% travel may be required.Other duties as required.Qualifications:Bachelor’s Degree and a minimum of 12 years of prior relevant experience. Graduate Degree and a minimum of 10 years of prior related experience. In lieu of a degree, minimum of 16 years of prior related experience.Active Secret Clearance required.Minimum 8+ years of experience directly developing thermal solutions for electronics.7+ years experience with heat transfer, thermal management, and cooling of electronics.Minimum 7+ years modeling, specifying, and testing thermal systems and thermal management solutions.Experience in packaging and cooling of high-power electronics.Exeperiece with the thermal management of GaAs, GaN, SiGe, and silicon active components.Experience with thermal testing techniques and instrumentationLow-Cycle solder fatigue analysis.Experience managing suppliers and sub-contractors of thermal management solutions to schedule and technical performance.Preferred Additional Skills:Excellent people skills to include collaborating in a multi-disciplinary, diverse, and dynamic team environment.Experienced using thermal simulation software for transient and steady state analysis.Proficient with ANSYS or Ice Pak thermal analysis software.Knowledge of thermal ablative materials and analytical predicting of useful life.Clear and concise communication skills; written and verbal.Understanding and background in fluid distribution networks and flow balancingKnowledge of and experience with calculation of aerodynamic heating.Clear and concise communication of technical principles to peers and non-technical audiencesKnowledge of and experience with design of RF radome for high heat flux environments.Knowledge of radar systems and high-temperature radome materials.Experience in design for and testing to military environments (i.e., temperature, vibration, shock, etc.)CAD software experience.Knowledge and experience of phase change cooling techniques.Knowledge and experience with submerged liquid cooling and dielectric cooling fluids.

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