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Process Engineer Sr, Packaging
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$81,780 - $113,000 a year
Full-time
- The Advanced Electronics and Photonics Core Facility (AEP) is expanding and hiring a Process Engineer Sr, Packaging.
- In this period of expansion, AEP is adopting 300 mm, industry-scale wafer processing equipment.
- Using a fee-for-service foundry model, this expansion will further allow AEP to serve the local semiconductor industry’s needs by bringing both small- and large-scale, flexible electronics projects to the marketplace.
- Mentor and/or train customers on semiconductor processing (e.g., technical nuances, tool operation, characterization, and more)
- Direct experience processing wafer compression molding, grinding, dicing, and bump processing
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