Fabric Cryptography

As a Sr. thermal engineer, you will be responsible for the thermal design and qualification while working with a cross functional engineering team as we bring Fabric’s newest devices to high volume production.. 8+ years of experience in the use of thermal and stress modeling simulation software (e.g. Flotherm, ANSYS Icepak or ANSYS Mechanical)FEA/CFD theory.. IC package bring-up including feasibility study, CPI, design optimization, simulation, manufacturing and qualification. Profound knowledge of IC packaging & assembly process, IC package/substrate material, SMT, FA, reliability and qualification etc. Material characterization with TMA/DMA/DSC measurement

thermal engineer

FABRIC CRYPTOGRAPHY FABRIC CREATES NEXT-GENERATION CRYPTOGRAPHY TECHNOLOGY THAT REIMAGINES TRUST AND PRIVACY.   Fabric is a fast-growing Series A full-stack silicon, hardware and cloud company that was founded to unlock the next generation of cryptography. Encryption and decryption secured the Internet as we know it. The next paradigm of cryptography is revolutionizing how we trust each other. We are the first to build a new class of processor for the rapidly emerging verifiable compute market. Fabric’s flagship product - the Verifiable Processing Unit (VPU) is a general-purpose, fully programmable cryptography chip built from the ground up to accelerate next-gen cryptography, such as zero-knowledge proofs and fully homomorphic encryption. With $39 million in equity and >$50 million in pre-orders, we are rapidly scaling our team of 60+ employees to build the foundation of verifiability for the Internet. About The Job As a Sr. thermal engineer, you will be responsible for the thermal design and qualification while working with a cross functional engineering team as we bring Fabric’s newest devices to high volume production. In this role you will define a thermal architecture for datacenter compute products. Communicate advantages and disadvantages of system architecture options with respect to heat dissipation. Work directly with design partners to implement optimum design solutions. Own the thermal mechanical analysis, test, and qualification of advanced IC packages, modules, PCBs and full systems. Support failure reviews and root-cause analysis with test data and thermal analysis. Experience & Experience Requirements... <ul><li>Master’s or higher degree in Engineering, Applied Physics, or related fields. </li><li>Excellent problem solving, teamwork, collaboration, and interpersonal skillsInterface w/suppliers, engineering, manufacturing, quality and other development groups to ensure the successful development and launch of new products. </li><li>8+ years of experience in the use of thermal and stress modeling simulation software (e.g. Flotherm, ANSYS Icepak or ANSYS Mechanical)FEA/CFD theory. </li><li>IC package bring-up including feasibility study, CPI, design optimization, simulation, manufacturing and qualification</li><li>Profound knowledge of IC packaging & assembly process, IC package/substrate material, SMT, FA, reliability and qualification etc</li><li>Material characterization with TMA/DMA/DSC measurement</li><li>Reliability testings with Temperature Cycling / Mechanical Drop etc</li><li>Failure Analysis, identifying root cause of problems and identify practical/timely solutions</li><li>Ability to build strong cross functional relationships </li></ul>Fabric Cryptography is committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate based on race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

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