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Principal Mechanical Engineer - Telecom Electronics Packaging
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Full-time
- LevelUp Force has an immediate need for a Principal Mechanical Engineer - Telecommunications Electronics Packaging to support one of our prestigious Satellite Network Provider customers in Germantown, MD with leading its division for the research and development of cutting-edge satellite communication equipment & systems.
- This includes responsibility for engineering mechanical solutions to electronic packaging challenges at the chip level, board level, enclosure level, and Data Center level with a major focus on custom indoor and outdoor enclosure design & development, protecting custom circuit board designs from harsh environments.
- Participate in the full product life cycle from Concept Industrial Design, Analysis, CAD Development, Prototyping, Testing, Production Release & ongoing Production Support.
- 5+ years using 3D CAD System CREO.
- 5+ years of broad material design for high volume fabrication techniques (including plastics, die castings, extrusions, sheet metal, & elastomers).
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