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Photolithography - HBM Process Development Engineer
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- Micron's Wafer Level Packaging Technology Development group is seeking a Photo Process Development Engineer to join a growing team of Technology Development (TD) engineers responsible for developing, characterizing, and transferring manufacturing capable solutions for future interconnect and wafer level processing applications.
- As a Photolithography Engineer in Micron's R&D group, you are authority for lithography process module development for memory devices, applying your expertise at multiple functional levels advising both direct and parallel management of critical process selection decisions.
- You will be a domain expert in overlay and overlay metrology and use your expertise to optimize overlay and develop roadmaps for wafer bonding overlay, as well as lithography overlay post-bonding.
- Sophisticated process development tasks will include performing material evaluations; reticle, layout and OPC development; process window analysis; and overlay optimization.
- Solid understanding of lithography overlay including metrology techniques related to overlay.
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