Qualcomm

This involves optimizing system co-design of IC-PKG-PCB die keeping in mind package footprint/height constraints, IC floor-planning, PCB, high-speed signal integrity, power distribution network, and thermal constraints.. Package design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs. Package design flow methodology implementing power distribution network (PDN) constraints for high speed processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levels. Working knowledge of IC package and/or PCB selection, design , and layout experience - Experience in Pinmap optimization of optimal PCB design. Experience or knowledge in PCB design process like Schematic capture

system design engineer

Company Qualcomm Technologies, Inc. Job Area Engineering Group, Engineering Group > Packaging Engineering General Summary The IC Package System Design Team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible for road mapping, architecting, design methodology, design implementation and verification for all Qualcomm package products (Digital, RF, Analog, PMIC, etc...). Job responsibilities for this position include package selection, package design, and package EE modeling. This involves optimizing system co-design of IC-PKG-PCB die keeping in mind package footprint/height constraints, IC floor-planning, PCB, high-speed signal integrity, power distribution network, and thermal constraints. Additional Responsibilities <ul><li>IC top level floor planning including hard macro block placement, padring, RDL and bump pattern/assignment</li><li>System level co-design methodology of IC, Package and PCB/Board</li><li>Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost</li><li>Package design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs</li><li>Package design flow methodology implementing power distribution network (PDN) constraints for high speed processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levels</li><li>Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products </li></ul>Minimum Qualifications <ul><li>Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.</li><li>2+ years Hardware Engineering experience or related work experience. </li></ul>This is an office-based position located in San Diego, CA. Preferred Qualifications <ul><li>Working knowledge of IC package and/or PCB selection, design , and layout experience - Experience in Pinmap optimization of optimal PCB design</li><li>Working knowledge of die floor planning, IO placement, and bump placement</li><li>Working knowledge of Chip, Package and PCB co-design methodology</li><li>Experience with high speed SerDes and DDR layout process</li><li>Experience in IO + PKG + PCB SI/PI modeling, co-simulation and analysis</li><li>Experience in 3D/2D EM simulation tool, electromagnetic theory and transmission line theory</li><li>Experience or knowledge in PCB design process like Schematic capture</li><li>Familiar with assembly and substrate manufacturing process</li><li>Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.</li><li>Familiar with PCB stack-up and breakout strategy </li></ul>Although this role has some expected minor physical activity, this should not deter otherwise qualified applicants from applying. If you are an individual with a physical or mental disability and need an accommodation during the application/hiring process, please call Qualcomm’s toll-free number found here for assistance. Qualcomm will provide reasonable accommodations, upon request, to support individuals with disabilities as part of our ongoing efforts to create an accessible workplace. Qualcomm is an equal opportunity employer and supports workforce diversity. To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. Pay Range $115,500.00 - $173,500.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer! If you would like more information about this role, please contact Qualcomm Careers. 3061559

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