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Microelectronics Packaging Engineer (Mid - Level, Lead Or Senior) with Security Clearance
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Full-time
- The Boeing company is seeking aMicroelectronics Packaging Engineer (Mid-Level, Lead or Senior) to join our team in Huntington Beach, CA. This person will have a strong background in the current SOTA for advance packaging as it relates to microelectronics.
- A successful candidate will lead the innovation and development of novel 2.5D / 3D advanced packaging for high-speed/mixed signal/RF microelectronics applications inclusive of electrical performance of both active and passive elements, thermal-mechanical performance and design for manufactability and reliability.
- Within BR&T, Boeing's Solid State Electronics Development organization (SSED) performs microelectronics technology development and design for aerospace systems.
- Designs are implemented with state of the art semiconductor process technologies including CMOS, GaAs, GaN, and SiGe. SSED uses external wafer fabrication but performs design (architecture, RTL, synthesis, circuits, physical design, verification, packaging and test) in house.
- 1+ years of experience in the field of microelectronics packaging including MCM, heterogeneous integration, 3D chip stacking, etc
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