Upvote
Downvote
IC Package Design Engineer
Share Job
- Suggest Revision
- You will be responsible for Package/SIP/module physical design and layout, optimization, DV and tape out; and work with multi-functional teams to achieve optimized mechanical/electrical/ thermal performance for various types of chips.
- Knowledge of package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
- Basic understanding in some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.)
- Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance).
- Design experience with RFIC and 5G packages, SIP or module schematic and layout design experience.
Active Job
Updated TodaySimilar Job
Relevance
Active