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HBM Design Engineer Member of Technical Staff
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$184,000 - $323,000 a year
Full-time
- In the HBM Design Engineering team at Micron, we deliver novel solutions to increase bandwidth, and capacity and reduce latency across memory and storage solutions.
- You will be part of a highly multi-functional team of technical domain experts collaborating closely with a worldwide team of Design Engineering, Product Engineering, Process Development, Package Engineering, and our Business Units to implement a common goal of ensuring our future HBM roadmap is successful.
- You will apply your deep understanding of memory array architectures, high-speed interface design, logic & custom circuit design, memory subsystem operation, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target best-in-class performance, power, cost, reliability and quality for Micron’s HBM product portfolio.
- In HBM DEG (High Bandwidth Memory - DRAM Engineering Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence).
- The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison.
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