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HBM Design Engineer - Member of Technical Staff
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$171,000 - $298,000 a year
- Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
- Our Opportunity Summary:For more than 43 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies.
- In the HBM Design Engineering team at Micron, we deliver novel solutions to increase bandwidth, and capacity and reduce latency across memory and storage solutions.
- You will apply your deep understanding of memory array architectures, high-speed interface design, logic & custom circuit design, memory subsystem operation, high-performance computing architectures, and & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target best-in-class performance, power, cost, reliability and quality for Micron’s HBM product portfolio.
- In HBM DEG (High Bandwidth Memory - DRAM Engineering Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence).
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