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Northrop Grumman Mission Systems is seeking a talented and motivated Microelectronics Manufacturing Process Engineer for our Advanced Packaging Technology µ-Line in Apopka, Florida.. Northrop Grumman's semiconductor foundry, packaging, integration, and test lines have unique capabilities of supporting a range of production microelectronics and providing leading-edge technology development.. Supporting factory maintenance personnel with the troubleshooting and repair of process equipment. Knowledge of relevant semiconductor processes, such as electrochemical plating, electroless plating, contact lithography, spin-on resists wet chemical processing, thin spin sputter deposition, and solder sphere bump processing.. Complete understanding and wide application of technical knowledge of relevant semiconductor processes, such as electrochemical plating, electroless plating, contact lithography, spin-on resist wet chemical processing, thin spin sputter deposition, and solder sphere bump processing.

principal engineer

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. Responsibilities Northrop Grumman Mission Systems is seeking a talented and motivated Microelectronics Manufacturing Process Engineer for our Advanced Packaging Technology µ-Line in Apopka, Florida. Northrop Grumman's semiconductor foundry, packaging, integration, and test lines have unique capabilities of supporting a range of production microelectronics and providing leading-edge technology development. The Apopka Florida wafer bumping µ-Line will support flip chip, 2.5D, and 3D packaging for internal and external production customers as well as emerging technology programs. The line will provide a range of bump compositions. Techniques will include sputter, electro-plating, and solder-sphere transfer to support flip chip, 2.5D, and 3D packaging using 100 mm to 300mm wafers. The devices supported in Apopka will also be subjected to singulation and die/wafer probe testing. The Engineer Microelectronic Semiconductors/Principal Engineer Microelectronic Semiconductors will provide manufacturing and development technical support and direction on a wide range of bumping processes. Responsibilities include, but are not limited to, the tasks outlined below: <ul><li> Support multiple wafers bumping processes.</li><li> Support development and leading the aspects of the qualification of new bump and micropump compositions and process flows.</li><li> Working with cross-site program, test, and reliability teams to achieve package qualifications and troubleshoot manufacturing and development issues.</li><li> Ability to understand program package requirements and support advisement on suitable bump metallurgies and process flows as applicable.</li><li> Solving manufacturing problems related to materials, designs, equipment, and people on time to support production.</li><li> Developing new and maintaining existing manufacturing processes with a focus on affordability, sustainability, and quality</li><li> Developing and revising process documentation and work instructions</li><li> Monitoring process yields, cost, and process stability and capability</li><li> Supporting the creation and implementation of improvement plans based on the above metrics.</li><li> Developing ROI justification for process improvements</li><li> Assisting with the training of new personnel and participating in the design of operator training materials</li><li> Supporting factory maintenance personnel with the troubleshooting and repair of process equipment</li><li> Leading/facilitating Root Cause & Corrective Action investigations using 8D Problem Solving methodologies.</li><li> Supporting capital equipment projects through procurement, installation, and release for production use</li><li> Supporting engineering data analysis including metrology data, ERP (SAP) data, and other in-process metricsThe chosen candidate must have excellent verbal and written communication skills; be able to multi-task in a fast-paced, dynamic, and high-visibility environment; and work well as part of a team. Basic Qualifications for an Engineer Microelectronic Semiconductors:</li><li> Bachelor's degree or higher in Engineering or other related STEM area and at least two (2) years of experience in Manufacturing/Process Engineering, Production, or related area - OR - a master's degree</li><li> Manufacturing/Process Engineering experience in a high-volume semiconductor manufacturing environment</li><li> Knowledge of relevant semiconductor processes, such as electrochemical plating, electroless plating, contact lithography, spin-on resists wet chemical processing, thin spin sputter deposition, and solder sphere bump processing.</li><li> Familiarity with the Design of Experiments (DOE), Statistical Process Control (SPC), 6 Sigma concepts for process development and control</li><li> Experience in technical data collection, organization, and analysis skills.</li><li> Proficient in data analysis techniques/programs.</li><li> Excellent oral and written communication skills and a strong attention to detail.</li><li> Work efficiently in a group as an individual contributor.</li><li> Knowledge and an understanding of project management.</li><li> Fluency in MS Office software applications</li><li> Familiarity with ERP systems; SAP preferred.</li><li> US Citizenship is required.Basic Qualifications for a Principal Engineer Microelectronic Semiconductors:</li><li> Bachelor's degree or higher in Engineering or other related STEM area and at least five (5) years of experience in Manufacturing/Process Engineering, Production, or a related area - OR - a master's degree and three (3) years of experience</li><li> Senior Manufacturing/Process Engineering experience in a high-volume semiconductor manufacturing environment with direct process ownership of one or more process areas</li><li> Complete understanding and wide application of technical knowledge of relevant semiconductor processes, such as electrochemical plating, electroless plating, contact lithography, spin-on resist wet chemical processing, thin spin sputter deposition, and solder sphere bump processing.</li><li> Provides technical solutions to a wide range of complex and difficult problems.</li><li> Independently determines and develops an approach to solutions.</li><li> Represents the organization in providing solutions to difficult technical issues associated with specific projects.</li><li> Expert in the Design of Experiments (DOE), Statistical Process Control (SPC), and 6 Sigma concepts for process development and control</li><li> Excellent data collection, organization, and analysis skills</li><li> Proficient in data analysis techniques/programs.</li><li> Excellent oral and written communication skills and a strong attention to detail.</li><li> Ability to work independently (highly self-motivated)</li><li> Work efficiently in a group as a technical leader and a contributor.</li><li> Advanced knowledge of project management and experience leading cross-functional project teams.</li><li> Fluency in MS Office software applications</li><li> Familiarity with ERP systems; SAP preferred.</li><li> US Citizenship is required.Preferred Qualifications:</li><li> Experience with Matlab, VBA, and/or similar.</li><li> Experience with CAD software (AutoCAD, NX, or similar)</li><li> Experience with Minitab software.</li><li> Experience with SAP MRP software.</li><li> Experience with UBM and solder bump metallurgy and how they impact package reliability.</li><li> Experience with both lead and lead-free bump technologies.</li><li> Experience in flip-chip, 2.5D, and 3D packaging.</li><li> Active Secret Clearance</li><li> Blackbelt CertificationMANUMS Salary Range: $75,300 - $112,900 </li></ul>Salary Range 2: $92,600 - $139,000 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates. Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://www.northropgrumman.com/EEO . U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.

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