BOEING

Our teams are currently hiring multiple Analog Mixed Signal Integrated Circuit Design Engineer (Associate, Mid-Level, or Lead).. SSED uses external wafer fabrication services but executes the whole design flow in-house (architecture definition, circuit design, RTL, synthesis, physical layout, verification, packaging and testing).. The Analog/Mixed Signal Design Engineer is expected to contribute to all phases of design and development from requirement definition, initial concepts, architecture, and trade studies, through behavioral modeling, circuit design and layout implementation.. Experience with industry Electronic Design Automation (EDA) tools and methodologies for digital ASIC/FPGA/SoC design and verification (e.g. Synopsys, Cadence). Experience developing Analog/Mixed-Signal ICs for extreme environment applications (e.g. radiation-hardened, extreme low/high temperatures, ultra-long lifetime)

circuit design engineer

Job Description At Boeing, we innovate and collaborate to make the world a better place. From the seabed to outer space, you can contribute to work that matters with a company where diversity, equity and inclusion are shared values. We’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us. Our teams are currently hiring multiple Analog Mixed Signal Integrated Circuit Design Engineer (Associate, Mid-Level, or Lead). This position will be based out of Huntington Beach, CA; Annapolis Junction, MD; Berkley, MO (In St. Louis surrounding area). At Boeing, we innovate and collaborate to make the world a better place. From the seabed to outer space, you can contribute to work that matters with a company where diversity, equity and inclusion are shared values. We’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us. We are Boeing Research & Technology (BR&T): Boeing's global research and development team creating and implementing innovative technologies that make the impossible possible and enable the future of aerospace. We are engineers and technicians, skilled scientists, and bold innovators: join us and put your passion, determination, and skills to work building the future! #TheFutureIsBuiltHere #ChangeTheWorld Within BR&T, Boeing’s Solid State Electronics Development organization (SSED) performs microelectronics technology development for aerospace systems. SSED develops digital, analog, mixed-signal and RF Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications, processing, and other electronic functions. These systems are used on Boeing airborne, terrestrial, and satellite platforms. Designs are implemented with state-of-the-art semiconductor process technologies. SSED uses external wafer fabrication services but executes the whole design flow in-house (architecture definition, circuit design, RTL, synthesis, physical layout, verification, packaging and testing). SSED owns numerous microelectronics projects, funded both by internal Boeing programs and external U.S. Government Science and Technology (S&T) customers. SSED’s large staff of microelectronics engineers conducts research and designs microelectronics hardware in support of these projects. Currently SSED is actively hiring Analog Mixed Signal Design Engineers (Associate, Mid-Level, Lead), who have expertise in integrated circuit research and design with advanced CMOS/BiCMOS semiconductor technologies. The Analog/Mixed Signal Design Engineer is expected to contribute to all phases of design and development from requirement definition, initial concepts, architecture, and trade studies, through behavioral modeling, circuit design and layout implementation. As well as ability to define test plans and support testing of the chips in a lab. Position Responsibilities: <ul><li>Design of Analog/Mixed-Signal IC macros from specification to tape out, including but not limited to:</li><li>ADCs/DACs and other signal converters</li><li>DLLs/PLLs and other timing circuits</li><li>High Speed SerDes interfaces</li><li>Analog precision blocks such as Voltage/Current references, Temperature sensors, Signal conditioning channels</li><li>Power Management blocks such as linear or switching regulators</li><li>VCOs, synthesizers</li><li>Specialized design for extreme temperatures, harsh radiation environments, ultra-low power and small-area solutions</li><li>Layout execution and supervision</li><li>Documentation development for design traceability and testing enablement</li><li>Circuit test and characterization in a laboratory environment</li><li>(Mid-level and higher) Lead and mentor junior engineers </li></ul>This position is hybrid. This means that the selected candidate will be required to perform some work onsite at one of the listed location options. This is at the hiring team’s discretion and could potentially change in the future. This position must meet Export Control compliance requirements, therefore a “US Person” as defined by 22 C.F.R. <ul><li>120.15 is required. “US Person” includes US Citizen, lawful permanent resident, refugee, or asylee. </li></ul>Basic Qualifications (Required Skills and Experience): <ul><li>Bachelor, Master, or Doctorate degree from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry</li><li>1+ years of experience in the design/development of Integrated Circuits</li><li>Experience with industry Electronic Design Automation (EDA) tools and methodologies for digital ASIC/FPGA/SoC design and verification (e.g. Synopsys, Cadence) </li></ul>Preferred Qualifications (Desired Skills/Experience): <ul><li>3+ years of related work experience or an equivalent combination of education and experience</li><li>5+ years of related work experience or an equivalent combination of education and experience </li><li>Proven ability to derive requirements and complying with specifications in circuits and systems</li><li>Designed and tape out at least one circuit block as a lead</li><li>Greater than the minimum level of design experience in Analog, Digital, Mixed-Signal, RF domains, or experience designing and/or testing chips in more than one domain.</li><li>Experience with commercial Cadence tools (Virtuoso suite and Spectre simulator products)</li><li>Experience working on large-scale SoC design teams.</li><li>Experience developing Mixed-Signal circuits in state-of-the-art semiconductor fabrication processes (e.g. 7/10/12/14/16nm FinFET CMOS, 22nm FDSOI CMOS, BiCMOS)</li><li>Experience developing Analog/Mixed-Signal ICs for extreme environment applications (e.g. radiation-hardened, extreme low/high temperatures, ultra-long lifetime)</li><li>Experience with development of Analog/Mixed-Signal circuits for hardware security applications</li><li>Experience supporting military radar, communications, electronic warfare, or avionics/mission data processing programs</li><li>Experience organizing and leading teams, including military experience as a commissioned or non-commissioned officer</li><li>Demonstrated track record as a high performance team member</li><li>Excellent verbal and written communication ability</li><li>Active security clearance </li></ul>Typical Education & Experience: Associate (Level 2) Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 2 or more years' related work experience or an equivalent combination of technical education and experience (e.g. Master). In the USA, ABET accreditation is the preferred, although not required, accreditation standard. Mid-Level (Level 3) Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 5 or more years' related work experience or an equivalent combination of technical education and experience (e.g. PhD, Master+3 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard. Lead (Level 4) Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 9 or more years' related work experience or an equivalent combination of technical education and experience (e.g. PhD+4 years' related work experience, Master+7 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard. Relocation: This position offers relocation based on candidate eligibility. Drug Free Workplace: Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies. Shift Work Statement: This position is for 1st shift. At Boeing, we strive to deliver a Total Rewards package that will attract, engage and retain the top talent. Elements of the Total Rewards package include competitive base pay and variable compensation opportunities. The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work. The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements. Pay is based upon candidate experience and qualifications, as well as market and business considerations. Summary pay range Associate Level 2: $79,900.00 - $116,150.00 Summary pay range Mid-Level Level 3: $97,750.00 - $141,450.00 Summary pay range Lead Level 4: $118,150.00 - $171,350.00 Applications for this position will be accepted until March 5th, 2024. BRT_MSA Export Control Requirements: U.S. Government Export Control Status: This position must meet export control compliance requirements. To meet export control compliance requirements, a “U.S. Person” as defined by 22 C.F.R. <ul><li>120.15 is required. “U.S. Person” includes U.S. Citizen, lawful permanent resident, refugee, or asylee. </li></ul>Export Control Details: US based job, US Person required Equal Opportunity Employer: Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.

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