Micron Technology

Drive novel solutions with SoC architects, silicon design, and product teams to recommend the optimum package solutions to meet electrical, mechanical, thermal, and other system level requirements.. Coordinate package design and assembly of advanced 2.5D/3D packages, driving material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable DFM requirements.. Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures.. Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle.. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.

distinguished member of technical staff

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Advanced Packaging Distinguished Member of Technical Staff/Fellow in the Compute and Networking Business Unit (CNBU), you will lead Micron’s Advanced Packaging strategy and drive innovation to ensure a leadership portfolio and best in class product roadmap. You will have the opportunity to collaborate with the industry leading technologists at partners like (include specific companies in HR allows). You will collaborate with Micron’s world-wide talent that include research and development, engineering, sales, manufacturing and operations. As a part of this role, you will have the opportunity to directly interact with senior executives on the product plans and its alignment to market needs. Together, we will be responsible for the definition, development, and delivery of state-of-the-art products that will advance compute and shape the future of this planet and beyond. Responsibilities Will Include, But Are Not Limited To <ul><li>Develop and maintain strong relationships at key enablement partners and definitional customers</li><li>Drive novel solutions with SoC architects, silicon design, and product teams to recommend the optimum package solutions to meet electrical, mechanical, thermal, and other system level requirements.</li><li>Coordinate package design and assembly of advanced 2.5D/3D packages, driving material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable DFM requirements.</li><li>Interface closely with Micron’s internal manufacturing and external partners to productize advanced packaging solutions from concept to prototyping to mass production phases.</li><li>Support and collaborate with customers to ensure that Micron’s products can meet their quality, reliability, system, and operational needs. </li></ul>Successful Candidates For This Position Will Have <ul><li>An established network with peers in the industry and relationships with key stakeholders </li><li>Awareness of packaging roadmaps and business models across the hardware stack and services</li><li>Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical stakeholders.</li><li>Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures. </li><li>Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle.</li><li>Strong publication record, patents, or contributions to industry standards are highly desirable.</li><li>Demonstrated leadership experience in guiding cross-functional teams and driving technical excellence. </li></ul>Required Experience <ul><li>Bachelor/Master of Science in materials, mechanical, chemical, or electrical engineering. MS or PhD preferred</li><li>10+ years of relevant experience </li></ul>As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work click here. To learn more about Micron, please visit micron.com/careers For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3) Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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