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Senior Engineer, SiP Semi Packaging Engineer
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- Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world.
- The senior engineer in this role is required (1) to work cross-functionally with business units, product designers, US-based and Asia-based manufacturing, reliability teams; and (2) to determine integrated SiP solutions that considers optimal tradeoffs between cost, reliability, and time-to-market while meeting product-level performance requirements.
- Functional ownership of all aspect of package design and assembly processes at all phases of product development from conceptualization, through design engineering, prototypes, sampling, reliability stress testing, and release-to-manufacturing
- Design and develop integrated SiP packages based on multi-layer organic substrates with Wirebond and advanced Flip Chip interconnects.
- Project management with offshore resident engineering teams and internal product development teams that include product designers, marketing, quality, and reliability engineering.
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