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Materials Analysis Engineer I
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- Rochester Electronics is immediately hiring for a Materials Analysis Engineer I!
- Provides wafer or die level X-Section and Strip-back analysis for Failure Analysis, Quality, or IC Recreation.
- Performs installations of failure analysis equipment and follows testing procedures to ensure proper working order of the tool.
- Perform a variety of F/A junctions, including Chemical and Plasma De-processing, Cross Sectioning, Junction Staining, Optical and SEM microscopy, EDS, SEM Backscatter, Laser Isolation, the use of a FIB (Focused Ion Beam), and C-SAM(Scanning Acoustic Microscopy).
- A Bachelor’s degree in microelectronics, physics, or electrical engineering.
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