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One of our most challenging new fields is the Microelectronics Designs and Applications (MDA) Business Area (BA), which combines the unique properties of superconductivity and quantum mechanics to develop radical new energy-efficient computing systems.
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We are actively seeking a Hybrid Assembly and Microelectronics Packaging Engineer, for the Advanced Electrical Fabrication Group. As a Hybrid Assembly & Microelectronics Packaging Engineer.
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Your primary responsibility will be to interface with electrical and mechanical engineers from around the Laboratory, develop process plans and technical capabilities to build their hardware, and be hands on while leading the hardware development through the surface mount electronics fabrication and microelectronics assembly fabrication area.
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Some of the types of systems we develop include but are not limited to: RF communications Position, navigation, and timing (PNT) Microelectronics (including custom ASIC development and packaging) Sensor systems (audio, image, motion, etc.
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In addition, we are seeking skills that include computer design, microelectronics, radio frequency design, and systems engineering. Assist with setup, testing, and integration of VSAT (Very Small Aperture Terminal) SATCOM systems.
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The Senior Mechanical Engineer leads and supports teams in the design, analysis, manufacture and test of digital, RF/analog and mixed microelectronics hardware at multiple levels of integration (chip, component, printed circuit board) across a multitude of platforms/domains.
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As an Electronics & Microelectronics Manufacturing Engineer you will. Serve as the expert in microelectronics assembly designing assembly workflows, as well as adjusting current workflow to meet sponsor’s requirements.
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Analyze results of RF collection in support of national mission requirements Lead new advances in RF engineering and push the leading edge of RF communications technologies: Antenna theory, design, and fabrication techniques with particular focus on beam-forming technologies - Modulation (BPSK, QPSK, spread spectrum, etc.
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The Northrop Grumman Mission Systems (NGMS) Microelectronics Design and Applications business pushes the boundaries of innovation, redefining the leading edge of exotic new technologies in computation, system security, and AI. Among our most challenging and exciting fields are Artificial Intelligence (AI) and Transformational Computing (TC.
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Experience working with DC to DC converters for the variety of internal derived voltages needed in modern microelectronics. Design, documentation, implementation, prototyping, and testing of next generation encryption devices on cutting edge ultra-low power digital circuit boards for NSA certified key loader.
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Expertise in microelectronics/semiconductor fabrication and advanced packaging: physical/chemical vapor deposition; dielectrics (including spin-on dielectrics), metals, superconducting materials, dry/wet etch processing, photolithography, failure analysis, semiconductor metrology, CMP, FEOL/BEOL, semiconductor product development, process control and sustainment.
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Microelectronics Engineering, integrated circuit design and integrated circuit reverse engineering skills. Our team specializes in vulnerability analysis and research, system emulation, software engineering, reverse engineering, embedded development, and cyber security.
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Relevant experience must be in one or more of the following: developing, designing, or integrating technical systems or subsystems; applying international telecommunication standards and protocols (for example, DWDM, VOIP, Layer 2/3 VPN, ISDN, SONET, or TCP/IP.
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As an IPT Lead you will be responsible for the execution of various design efforts, such as microelectronics packaging design and analysis, cryogenic component design, and other related efforts.
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Northrop Grumman's Mission Systems' (NGMS) Microelectronics Center is seeking a Deputy Program Manager 2 to support the Microelectronics Design and Applications (MDA) organization in Annapolis Junction, MD or Linthicum, MD. This position will report to the Director of Advanced Compute Programs and support daily execution of a superconducting computing program.
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microelectronics job in Annapolis Junction, MD
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