{"schemaVersion":"jobsearcher.job.v1","id":"ff16f66c38ea40050c8a748e","url":"https://jobsearcher.com/jobs/ff16f66c38ea40050c8a748e","canonicalUrl":"https://jobsearcher.com/jobs/ff16f66c38ea40050c8a748e","title":"Process Development Engineer - Packaging","description":"Process Development Engineer - Packaging\nLocation\n\nEmployment Type\n\nFull-time\n\nDepartment\n\nAbout the Company\nInlighten Technologies is a Silicon Valley startup developing next-generation microLED technologies for augmented reality (AR) and AI-powered smart glasses. Our mission is to push the limits of microLED performance and manufacturing, enabling scalable, mass‑market production. Join us to help create the displays that will power the future of immersive computing.\n\nDescription\nWe are seeking a Process Development Engineer - Packaging, to support the development and mass production of microLED AR light engines. This role will focus on advanced packaging processes, including die bonding, interconnection, optical integration, and reliability, working closely with device, optics, and system teams to transition technologies from R&D to volume manufacturing.\n\nKey Responsibilities\n\nDevelop, optimize, and qualify packaging processes for microLED AR light engines.\n\nLead process development for: MicroLED die bonding with FPC/PCB, Interconnect technologies, Wafer-level or panel-level packaging, Optical component integration (waveguides, collimators, micro-optics, etc.)\n\nDefine process flows, DOEs, and control plans for new packaging technologies\n\nDrive yield improvement, defect reduction, and cost optimization\n\nSupport EVT / DVT / PVT builds and ramp to mass production\n\nPerform failure analysis and root cause investigations related to packaging and assembly\n\nCollaborate with device, optics, system, equipment, and manufacturing teams\n\nWork with equipment vendors and material suppliers\n\nGenerate and maintain process documentation, specifications, and qualification reports\n\nMinimum Qualifications\n\nBachelor's degree or above in Materials Science, Electrical Engineering, Mechanical Engineering, or related field\n\n3-7 years of experience in advanced packaging or process development\n\nStrong understanding of semiconductor and optoelectronic packaging processes\n\nHands‑on experience with die attach, bonding, interconnect, and assembly processes\n\nExperience running DOE, process characterization, and data analysis\n\nFamiliarity with yield, reliability, and manufacturing metrics\n\nAbility to work in a cross-functional, fast-paced R&D-to-production environment\n\nAbility and willingness to travel internationally up to 20%\n\nPreferred Qualifications\n\nAdvanced degree (MS or PhD) in a relevant field of study.\n\nDirect experience with microLED, LED, or CIS packaging\n\nExperience in AR light engines or optical module packaging\n\nFamiliarity with reliability testing (thermal cycling, HTOL, humidity, drop, etc.)\n\nHands‑on experience with process yields analysis and defect characterization\n\nSalary Range: $104k - $208k/year\n\nComprehensive health, dental, and vision insurance.\n\nPaid holidays and vacation\n\nInlighten Technologies is an equal opportunity employer that is committed to inclusion and diversity. We promote equal opportunity for all applicants without regard to race, color, religion, sex, gender identity, sexual orientation, national origin, disability, veteran status, or any other legally protected characteristics.\n\n#J-18808-Ljbffr","company":"Inlightentech","rawCompany":"inlightentech","city":"Santa Clara","state":"CA","isRemote":false,"isActive":true,"createdAt":"2026-06-20T04:50:02.453Z","occupations":[{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"},{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"},{"code":"17-2199.07","title":"Photonics Engineers","slug":"photonics-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Process Development Engineer - Packaging","description":"Process Development Engineer - Packaging\nLocation\n\nEmployment Type\n\nFull-time\n\nDepartment\n\nAbout the Company\nInlighten Technologies is a Silicon Valley startup developing next-generation microLED technologies for augmented reality (AR) and AI-powered smart glasses. Our mission is to push the limits of microLED performance and manufacturing, enabling scalable, mass‑market production. Join us to help create the displays that will power the future of immersive computing.\n\nDescription\nWe are seeking a Process Development Engineer - Packaging, to support the development and mass production of microLED AR light engines. This role will focus on advanced packaging processes, including die bonding, interconnection, optical integration, and reliability, working closely with device, optics, and system teams to transition technologies from R&D to volume manufacturing.\n\nKey Responsibilities\n\nDevelop, optimize, and qualify packaging processes for microLED AR light engines.\n\nLead process development for: MicroLED die bonding with FPC/PCB, Interconnect technologies, Wafer-level or panel-level packaging, Optical component integration (waveguides, collimators, micro-optics, etc.)\n\nDefine process flows, DOEs, and control plans for new packaging technologies\n\nDrive yield improvement, defect reduction, and cost optimization\n\nSupport EVT / DVT / PVT builds and ramp to mass production\n\nPerform failure analysis and root cause investigations related to packaging and assembly\n\nCollaborate with device, optics, system, equipment, and manufacturing teams\n\nWork with equipment vendors and material suppliers\n\nGenerate and maintain process documentation, specifications, and qualification reports\n\nMinimum Qualifications\n\nBachelor's degree or above in Materials Science, Electrical Engineering, Mechanical Engineering, or related field\n\n3-7 years of experience in advanced packaging or process development\n\nStrong understanding of semiconductor and optoelectronic packaging processes\n\nHands‑on experience with die attach, bonding, interconnect, and assembly processes\n\nExperience running DOE, process characterization, and data analysis\n\nFamiliarity with yield, reliability, and manufacturing metrics\n\nAbility to work in a cross-functional, fast-paced R&D-to-production environment\n\nAbility and willingness to travel internationally up to 20%\n\nPreferred Qualifications\n\nAdvanced degree (MS or PhD) in a relevant field of study.\n\nDirect experience with microLED, LED, or CIS packaging\n\nExperience in AR light engines or optical module packaging\n\nFamiliarity with reliability testing (thermal cycling, HTOL, humidity, drop, etc.)\n\nHands‑on experience with process yields analysis and defect characterization\n\nSalary Range: $104k - $208k/year\n\nComprehensive health, dental, and vision insurance.\n\nPaid holidays and vacation\n\nInlighten Technologies is an equal opportunity employer that is committed to inclusion and diversity. We promote equal opportunity for all applicants without regard to race, color, religion, sex, gender identity, sexual orientation, national origin, disability, veteran status, or any other legally protected characteristics.\n\n#J-18808-Ljbffr","datePosted":"2026-06-20T04:50:02.453Z","dateModified":"2026-06-20T04:50:02.453Z","hiringOrganization":{"@type":"Organization","name":"Inlightentech","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Santa Clara","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"ff16f66c38ea40050c8a748e"},"url":"https://jobsearcher.com/jobs/ff16f66c38ea40050c8a748e"}}