{"schemaVersion":"jobsearcher.job.v1","id":"fb02206cb0ba3fc96ede00bd","url":"https://jobsearcher.com/jobs/fb02206cb0ba3fc96ede00bd","canonicalUrl":"https://jobsearcher.com/jobs/fb02206cb0ba3fc96ede00bd","title":"Advanced Packaging Development Engineer","description":"Summary\n\nApple’s Advanced Packaging team is seeking an experienced Packaging Development Engineer to drive next-generation packaging integration and technology development for future products. In this role, you will lead the definition, development, and qualification of cutting-edge 2.5D and 3D packaging technologies—incorporating features such as hybrid bonding, high-density interposers, fine-pitch microbumps, and Through-Silicon Vias (TSVs). You will work cross-functionally with silicon design, physical design, SI/PI, thermal, and manufacturing teams to guide technologies from early architecture exploration through qualification and high-volume manufacturing.\n\nDescription\n\nIn this role, you will be responsible for advanced package integration and technology development within a cross-functional team, driving novel 2.5D/3D architectures from early concept through qualification.\n\nMinimum Qualifications\n\nBS and 10 +years of relevant industry experience\n\nPreferred Qualifications\n\nPhD and 6+ years of experience in relevant industry, preferred.\nStrong technical background in 2.5D/3D packaging and semiconductor integration schemes (such as hybrid bonding, interposers, fine-pitch microbumps, and TSVs).\nSolid grasp of fab BEoL/MEoL interconnect processing, wafer-level packaging, and advanced assembly flows.\nUnderstanding of packaging materials, thermo-mechanical reliability, and chip-package interaction failure mechanisms.\nBroad systems mindset with the ability to balance package-level choices against silicon, electrical, thermal, and manufacturing constraints.\nExperience utilizing layout, physical design, or modeling tools alongside engineering data analysis.\nProven track record collaborating with and driving external foundries, OSATs, or material vendors.\nExcellent communication and collaboration skills across cross-functional hardware teams.\n\nAt Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $184,700 and $324,800, and your base pay will depend on your skills, qualifications, experience, and location.\n\nApple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits\n\nNote: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.\n\nApple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant\n\nAt Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.\n\nLearn about accessibility in Apple’s workplace\n\nLearn about reasonable accommodations for job applicants\n\nApple accepts applications to this posting on an ongoing basis.","company":"Apple","rawCompany":"apple","city":"Denver","state":"CO","isRemote":false,"isActive":false,"createdAt":"2026-11-08T09:59:43.845Z","occupations":[{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"},{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2141.00","title":"Mechanical Engineers","slug":"mechanical-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"541715","title":"Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)","slug":"research-and-development-in-the-physical-engineering-and-life-sciences-except-nanotechnology-and-biotechnology"},{"code":"513210","title":"Software Publishers","slug":"software-publishers"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Advanced Packaging Development Engineer","description":"Summary\n\nApple’s Advanced Packaging team is seeking an experienced Packaging Development Engineer to drive next-generation packaging integration and technology development for future products. In this role, you will lead the definition, development, and qualification of cutting-edge 2.5D and 3D packaging technologies—incorporating features such as hybrid bonding, high-density interposers, fine-pitch microbumps, and Through-Silicon Vias (TSVs). You will work cross-functionally with silicon design, physical design, SI/PI, thermal, and manufacturing teams to guide technologies from early architecture exploration through qualification and high-volume manufacturing.\n\nDescription\n\nIn this role, you will be responsible for advanced package integration and technology development within a cross-functional team, driving novel 2.5D/3D architectures from early concept through qualification.\n\nMinimum Qualifications\n\nBS and 10 +years of relevant industry experience\n\nPreferred Qualifications\n\nPhD and 6+ years of experience in relevant industry, preferred.\nStrong technical background in 2.5D/3D packaging and semiconductor integration schemes (such as hybrid bonding, interposers, fine-pitch microbumps, and TSVs).\nSolid grasp of fab BEoL/MEoL interconnect processing, wafer-level packaging, and advanced assembly flows.\nUnderstanding of packaging materials, thermo-mechanical reliability, and chip-package interaction failure mechanisms.\nBroad systems mindset with the ability to balance package-level choices against silicon, electrical, thermal, and manufacturing constraints.\nExperience utilizing layout, physical design, or modeling tools alongside engineering data analysis.\nProven track record collaborating with and driving external foundries, OSATs, or material vendors.\nExcellent communication and collaboration skills across cross-functional hardware teams.\n\nAt Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $184,700 and $324,800, and your base pay will depend on your skills, qualifications, experience, and location.\n\nApple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits\n\nNote: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.\n\nApple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant\n\nAt Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.\n\nLearn about accessibility in Apple’s workplace\n\nLearn about reasonable accommodations for job applicants\n\nApple accepts applications to this posting on an ongoing basis.","datePosted":"2026-11-08T09:59:43.845Z","dateModified":"2026-11-08T09:59:43.845Z","hiringOrganization":{"@type":"Organization","name":"Apple","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Denver","addressRegion":"CO","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"fb02206cb0ba3fc96ede00bd"},"url":"https://jobsearcher.com/jobs/fb02206cb0ba3fc96ede00bd"}}