{"schemaVersion":"jobsearcher.job.v1","id":"f71fe5e22439b028ecd0a37a","url":"https://jobsearcher.com/jobs/f71fe5e22439b028ecd0a37a","canonicalUrl":"https://jobsearcher.com/jobs/f71fe5e22439b028ecd0a37a","title":"Substrate Technologist","description":"At Apple, we believe new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV, etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation product package structure and configuration optimization. You will be responsible for Apple Package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with a cross-functional team to achieve the best package performance.\n\nDescription\n\nLead RFSIP package substrate development, pathfinding technology, and roadmap definition.\n\nWork with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.\n\nWork across a variety of cross-functional groups directly and involve themselves in engineering and product development.\n\nDrive industry with sophisticated package solutions, new material development, and specs.\n\n5% International travel.\",\"responsibilities\":\"Work with industry partners to develop new substrate technologies from concept to HVM for Apple packaging roadmap.\n\nWork with cross-functional groups to define & optimize new package substrate architectures based on performance, technical risk, cost, and availability etc.\n\nProblem solving of technical issues during the full product development cycle.\n\nPreferred Qualifications\n\nMS or Ph.D. and 5+ years of relevant industry experience.\n\nProven fundamentals in the material/chemistry/ or mechanical engineering field(s).\n\nIn-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.\n\nHands-on experience in substrate manufacturing and technology development: Cu plating, Lithography, Dielectric material, Laser via formation, Solder resist, etc.\n\nFamiliar with package assembly and integration process preferred.\n\nExperience in Cadence Allegro platform tools and design review for manufacturing (DFM).\n\nExceptional technology development & project management skills.\n\nStrong communication & collaborative skills.\n\nMinimum Qualifications\n\nBS and 10+ years of relevant industry experience.\n\nPay & Benefits\n\nAt Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $175,000 and $308,500, and your base pay will depend on your skills, qualifications, experience, and location.\n\nApple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits\n\nNote: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.","company":"Apple","rawCompany":"apple","city":"Alameda","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-08-06T14:23:08.750Z","occupations":[{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"19-2032.00","title":"Materials Scientists","slug":"materials-scientists"}],"industries":[{"code":"513210","title":"Software Publishers","slug":"software-publishers"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"541715","title":"Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)","slug":"research-and-development-in-the-physical-engineering-and-life-sciences-except-nanotechnology-and-biotechnology"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Substrate Technologist","description":"At Apple, we believe new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV, etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation product package structure and configuration optimization. You will be responsible for Apple Package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with a cross-functional team to achieve the best package performance.\n\nDescription\n\nLead RFSIP package substrate development, pathfinding technology, and roadmap definition.\n\nWork with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.\n\nWork across a variety of cross-functional groups directly and involve themselves in engineering and product development.\n\nDrive industry with sophisticated package solutions, new material development, and specs.\n\n5% International travel.\",\"responsibilities\":\"Work with industry partners to develop new substrate technologies from concept to HVM for Apple packaging roadmap.\n\nWork with cross-functional groups to define & optimize new package substrate architectures based on performance, technical risk, cost, and availability etc.\n\nProblem solving of technical issues during the full product development cycle.\n\nPreferred Qualifications\n\nMS or Ph.D. and 5+ years of relevant industry experience.\n\nProven fundamentals in the material/chemistry/ or mechanical engineering field(s).\n\nIn-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.\n\nHands-on experience in substrate manufacturing and technology development: Cu plating, Lithography, Dielectric material, Laser via formation, Solder resist, etc.\n\nFamiliar with package assembly and integration process preferred.\n\nExperience in Cadence Allegro platform tools and design review for manufacturing (DFM).\n\nExceptional technology development & project management skills.\n\nStrong communication & collaborative skills.\n\nMinimum Qualifications\n\nBS and 10+ years of relevant industry experience.\n\nPay & Benefits\n\nAt Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $175,000 and $308,500, and your base pay will depend on your skills, qualifications, experience, and location.\n\nApple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits\n\nNote: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.","datePosted":"2026-08-06T14:23:08.750Z","dateModified":"2026-08-06T14:23:08.750Z","hiringOrganization":{"@type":"Organization","name":"Apple","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Alameda","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"f71fe5e22439b028ecd0a37a"},"url":"https://jobsearcher.com/jobs/f71fe5e22439b028ecd0a37a"}}